Memory Controller Thermal Management via Dynamic Command Scheduling

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Solution Overview

Problem

The heat generated in memory devices can degrade performance and reduce the lifespan of memory systems, leading to reliability issues due to concentrated temperature regions within the devices.

Innovation Solution

A memory controller that includes a temperature monitor to update temperature scores and a scheduler to adjust command priorities based on temperature states, optimizing operation modes to manage heat distribution and balance performance and stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If memory devices operate at high capacity and high integration, then storage performance is improved, but heat concentration occurs in specific regions leading to reduced reliability

Engineering Contradiction:
Improvestorage capacityVSAvoiddevice reliability
Core Design Contradiction:
ProductivityVSReliability

Solution Approach 1:

The memory device is divided into multiple temperature zones (first temperature zone and second temperature zone) with different temperature characteristics. This segmentation allows different regions to operate at optimal temperatures, preventing heat concentration while maintaining high storage capacity.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

Different memory regions are assigned different temperature characteristics - some regions operate at higher temperatures while others operate at lower temperatures. This local quality differentiation enables high integration density while managing heat distribution across the device to maintain reliability.

Inventive Principle:
Principle #3Local quality

2Device complexity

If commands are processed in fixed order, then system simplicity is maintained, but temperature management efficiency is reduced

Engineering Contradiction:
Improvecontrol logic complexityVSAvoidtemperature management
Core Design Contradiction:
Device complexityVSTemperature

Solution Approach 1:

The command processing order is made dynamic rather than fixed. The controller adjusts the execution order of read and write commands based on real-time temperature conditions in different memory zones, allowing flexible temperature management while maintaining reasonable control logic complexity.

Inventive Principle:
Principle #15Dynamics

Solution Approach 2:

The system monitors temperature conditions in different memory zones and uses this feedback information to adjust command processing order. When temperature in a zone exceeds thresholds, the controller modifies subsequent command execution to allow cooling, creating a closed-loop temperature management system.

Inventive Principle:
Principle #23Feedback

Data Source

PatentUS11106559B2Memory controller and memory system including the memory controller
Publication Date: 2021.08.31 SK HYNIX INC
  • US11106559B2 patent drawing
  • US11106559B2 patent drawing
  • US11106559B2 patent drawing

AI summary

A memory controller includes a temperature monitor configured to update temperature states of a memory device divided into groups as temperature scores and a scheduler configured to update a command score using the temperature scores and change a priority of the command score to match with a current operation mode.