Memory Cooler With Diagonal Heat Fins
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Solution Overview
Problem
Memory modules in computer systems face thermal issues due to their proximity to heat-generating components like CPUs and chipsets, and those in the middle or furthest from cooling air often experience inadequate cooling.
Innovation Solution
A memory cooler design featuring a thermally conductive heat plate coupled to the memory module and heat fins that extend upward and curve diagonally, optimized for airflow patterns to enhance heat dissipation, with the fins' configuration allowing for increased reach and self-adjustment to maintain effective cooling even if airflow changes.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If memory modules are placed close to CPUs and chipsets to utilize board space, then space efficiency is improved, but thermal issues worsen due to proximity to heat-generating components
Solution Approach 1:
A heat plate is introduced as an intermediary component between the memory module and the surrounding environment. The heat plate thermally couples to the memory module's heat spreader and provides a dedicated thermal interface that separates the memory module from nearby heat-generating components while facilitating heat transfer to the cooling system.
Solution Approach 2:
The cooling solution extends into the vertical dimension by incorporating heat fins that protrude upward from the heat plate. This three-dimensional heat dissipation structure increases the cooling surface area without occupying additional horizontal board space, allowing memory modules to be placed closer to CPUs while maintaining adequate thermal management.
2Volume of moving object
If memory modules are positioned in the middle or furthest from cooling air to maximize board space utilization, then space efficiency is improved, but cooling effectiveness worsens
Solution Approach 1:
The heat fins are designed with the ability to rotate and self-adjust their orientation based on airflow conditions. This dynamic adaptation allows the fins to maintain optimal positioning relative to cooling air flow, ensuring effective heat dissipation regardless of the memory module's position on the motherboard.
Solution Approach 2:
The system changes the orientation parameter of the heat fins in response to varying airflow conditions. By adjusting the angular position of the fins, the cooling effectiveness is optimized for different locations on the motherboard, allowing memory modules to be placed in space-efficient positions without sacrificing cooling performance.
3Ease of manufacture
If heat fins are designed with fixed configuration, then manufacturing simplicity is improved, but adaptability to different airflow patterns worsens
Solution Approach 1:
The heat fins incorporate rotational joints or pivots that allow them to dynamically adjust their orientation. This mechanical flexibility enables the fins to adapt to different airflow patterns encountered at various motherboard positions, while the base structure remains simple enough for straightforward manufacturing.
Solution Approach 2:
The heat fins are designed to self-adjust their orientation in response to airflow forces without requiring external control systems. The fins automatically position themselves optimally relative to the cooling air flow, providing adaptability to different airflow patterns while maintaining manufacturing simplicity through passive mechanical design.
4Device complexity
If traditional cooling designs are used, then device simplicity is improved, but cooling effectiveness for memory modules in various positions worsens
Solution Approach 1:
The cooling device is segmented into distinct functional components: a heat plate for thermal coupling with the memory module, and multiple heat fins for heat dissipation. This segmentation allows each component to be optimized independently - the heat plate for thermal contact and the fins for adaptive cooling - improving overall effectiveness without excessive complexity.
Solution Approach 2:
The cooling solution transitions from a two-dimensional flat heat spreader to a three-dimensional structure with vertically extending heat fins. This addition of the vertical dimension significantly increases the heat dissipation surface area and enables effective cooling of memory modules regardless of their horizontal position on the motherboard, while maintaining relatively simple construction.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively addresses thermal challenges by ensuring optimal heat dissipation and minimizing airflow obstruction, maintaining efficient cooling of memory modules regardless of their position within the system.
Implementation Method 1
The heat plate has a top edge and an interior side. The interior side is to be thermally coupled to an exterior side of the memory module.
Implementation Method 2
The heat fins are configured according to the airflow, simulated or actual, in the enclosure.
Implementation Method 3
The heat fins extend upward from the top edge and curve diagonally away from the heat plate.
Data Source
AI summary
A cooler for a memory module includes heat plates on the sides of the memory module and heat fins extending from the top of the heat plates. The heat fins are optimized according to simulated or actual airflow about the memory module inside an enclosure. The heat fins may curve diagonally outward from the memory module and their free ends may be arranged substantially parallel to the airflow so air flows over their larger lateral surfaces down to the memory module.