Liquid Cooling Tubes for Memory Heat Spreaders
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Solution Overview
Problem
High-density, thin server products in the HPC industry face inadequate airflow for air-cooled solutions and limited field replacement of components in self-contained water-cooled solutions, which hinder effective cooling of memory modules.
Innovation Solution
A liquid cooling apparatus with a support and cooling tubes positioned parallel to computer memory connectors, removably coupled with memory component heat spreaders, utilizing thermally conductive materials like copper or aluminum to efficiently route cooling liquid above and alongside memory connectors.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air cooled solutions are used for memory modules, then the cooling apparatus is simple and easy to implement, but high-density, thin server products do not have sufficient airflow to support adequate cooling
Solution Approach 1:
The patent transitions from air cooling to liquid cooling by introducing a liquid cooling apparatus with cooling tubes positioned alongside memory connectors. The liquid cooling system uses a liquid coolant flowing through channels in a cooling plate to remove heat from the memory components, providing more effective cooling in high-density server products where airflow is insufficient.
2Temperature
If self-contained water cooled solutions are used for memory modules, then adequate cooling is achieved, but field replacement of the component being cooled is not allowed
Solution Approach 1:
The cooling apparatus is segmented into modular components including a cooling plate with channels, cooling tubes positioned alongside memory connectors, and a liquid coolant system. This segmentation allows the cooling infrastructure to be separate from the memory modules themselves, enabling field replacement of memory components while maintaining cooling effectiveness through the distributed cooling tube architecture.
3Temperature
If cooling tubes are positioned above and alongside memory connectors, then adequate cooling coverage is achieved, but the device structure becomes more complex
Solution Approach 1:
The cooling tubes are pre-positioned and coupled to the cooling plate structure before the memory modules are installed. The cooling tubes are positioned parallel to and alongside the memory connectors in advance, establishing the cooling infrastructure beforehand. This preliminary positioning simplifies the overall assembly process and reduces operational complexity during memory module installation and replacement.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides effective thermal management for high-density server products by ensuring adequate cooling of memory components, allowing for easy field replacement and improved energy efficiency.
Implementation Method 1
utilizing thermally conductive materials like copper or aluminum to efficiently route cooling liquid above and alongside memory connectors
Implementation Method 2
liquid cooling apparatus with a support and cooling tubes positioned parallel to computer memory connectors, removably coupled with memory component heat spreaders
Data Source
AI summary
Embodiments herein relate to liquid cooling interfaces for computer memory components. An apparatus for cooling a computer memory component may include a support and a cooling tube coupled with the support, where the cooling tube is to be positioned parallel to a computer memory connector to receive the computer memory component, and the cooling tube is to be removably coupled with a memory component heat spreader associated with the computer memory component. In some embodiments, the support may be a liquid manifold. Other embodiments may be described and/or claimed.