Memory Device Data Paths for Array Consolidation

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Solution Overview

Problem

Conventional memory device layouts require additional space and increase time delays due to the need for doubled master data lines for array/port consolidation and swapping, which affects performance and size efficiency.

Innovation Solution

A memory device layout where each master data line is positioned between a memory array and a port pad, with local data lines crossing multiple arrays and connecting to master lines, allowing data access through either port pad without increasing space or time delay.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If doubled master data lines are used for array/port consolidation and swapping, then array/port consolidation and swapping capability is improved, but device area increases

Engineering Contradiction:
Improvearray/port consolidation and swapping capabilityVSAvoiddevice area
Core Design Contradiction:
Adaptability or versatilityVSArea of stationary object

Solution Approach 1:

Each master data line is designed to serve multiple memory arrays by being electrically connectable to different local data line pairs through switches, allowing a single master data line to perform multiple functions across different arrays and ports, thereby eliminating the need for doubled master data lines

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The patent introduces switches that can dynamically reconfigure the electrical connections between master data lines and local data line pairs, allowing the data paths to be dynamically adjusted for different array/port combinations without requiring physical duplication of master data lines

Inventive Principle:
Principle #15Dynamics

2Adaptability or versatility

If doubled master data lines are used for array/port consolidation and swapping, then array/port consolidation and swapping capability is improved, but time delay increases

Engineering Contradiction:
Improvearray/port consolidation and swapping capabilityVSAvoidtime delay
Core Design Contradiction:
Adaptability or versatilityVSLoss of time

Solution Approach 1:

By making each master data line electrically connectable to multiple local data line pairs through switches, the patent eliminates the need for doubled master data lines, thereby preventing the time delay that would result from signal transmission through longer doubled paths

Inventive Principle:
Principle #6Universality (Multi-functionality)

Solution Approach 2:

The dynamic switching capability allows the system to select optimal data paths with minimal delay by configuring switches to connect master data lines to the appropriate local data line pairs based on the current access requirements, avoiding fixed long paths

Inventive Principle:
Principle #15Dynamics

3Adaptability or versatility

If local data lines cross multiple arrays, then array/port consolidation and swapping is enabled, but data path complexity increases

Engineering Contradiction:
Improvearray/port consolidation and swappingVSAvoiddata path complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent segments the data path into modular components: master data lines connecting ports to memory arrays, local data line pairs connecting within arrays, and switches providing selective connections. This segmentation allows complex array/port consolidation functionality to be achieved through simple, standardized modules rather than complex integrated paths

Inventive Principle:
Principle #1Segmentation

Data Source

PatentUS8570826B2Memory device having data paths facilitating array/contact consolidation and/or swapping
Publication Date: 2013.10.29 MICRON TECHNOLOGY INC
  • US8570826B2 patent drawing
  • US8570826B2 patent drawing
  • US8570826B2 patent drawing

AI summary

Apparatus and methods are disclosed, such as those involving array/port consolidation and/or swapping. One such apparatus includes a plurality of port pads including a plurality of contacts; a plurality of memory arrays; and a plurality of master data lines. Each of the master data lines extends in a space between one of the port pads and a respective one of the memory arrays. Each of the master data lines is electrically connectable to the contacts of a respective one of the port pads. The apparatus further includes a plurality of local data lines, each of which extends over a respective one of the memory arrays. Each of the local data lines is electrically connectable to a respective one of the master data lines. At least one of the local data lines extends over at least two of the memory arrays. This configuration allows memory array consolidation and/or swapping without increasing die space for additional routing and adversely affecting performance of the apparatus.