Semiconductor Memory Debug via Internal Testing Interface

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Solution Overview

Problem

The increasing complexity of semiconductor device designs makes silicon debug processes incomplete due to the need for large data communication, which is time-consuming and often requires direct connections or unavailable chip-level pins, potentially altering the design under test.

Innovation Solution

A debugging system using a testing interface, such as an internal Joint Test Action Group (iJTAG) interface, that communicates test data with semiconductor devices mounted on a circuit board without modifying the FPGA or requiring access to unavailable chip-level pins, utilizing test control circuitry to manage clock signals and communicate data from memory elements.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of information

If memory and scan chain dumps are used to obtain large amounts of data for debugging, then debugging information completeness is improved, but testing time increases significantly

Engineering Contradiction:
Improvedebugging information completenessVSAvoidtesting time
Core Design Contradiction:
Loss of informationVSLoss of time

Solution Approach 1:

The patent extracts only the necessary debugging information from the semiconductor device through targeted test operations via the test interface, rather than dumping all memory and scan chain data. This selective extraction approach obtains sufficient debugging information while significantly reducing the time required for data communication.

Inventive Principle:
Principle #2Taking out (Extraction)

2Reliability

If a direct connection between test device and semiconductor device is established for data communication, then data transmission reliability is improved, but device complexity and pin requirements increase

Engineering Contradiction:
Improvedata transmission reliabilityVSAvoidpin requirements
Core Design Contradiction:
ReliabilityVSDevice complexity

Solution Approach 1:

The patent utilizes an existing test interface (such as I2C, SPI, or UART) that serves multiple functions including normal device operation and debugging communication. This multi-functional approach eliminates the need for dedicated debug pins and direct connections, reducing device complexity while maintaining reliable data transmission through the shared interface.

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of operation

If FPGA configuration is modified for state observation during debugging, then debugging capability is improved, but design stability deteriorates

Engineering Contradiction:
Improvedebugging capabilityVSAvoiddesign stability
Core Design Contradiction:
Ease of operationVSStability of the object's composition

Solution Approach 1:

The patent introduces a test control circuit as an intermediary component that interfaces between the test device and the semiconductor device. This intermediary enables debugging operations by controlling test signal generation and data communication without requiring modifications to the FPGA configuration, thereby maintaining design stability while improving debugging capability.

Inventive Principle:
Principle #24Intermediary (Mediator)

Data Source

PatentUS11500017B1Testing memory elements using an internal testing interface
Publication Date: 2022.11.15 XILINX INC
  • US11500017B1 patent drawing
  • US11500017B1 patent drawing
  • US11500017B1 patent drawing

AI summary

A semiconductor device comprises a plurality of memory elements, test control circuitry, and a testing interface. The test control circuitry is configure to determine that one or more clock signals associated with the memory elements have been stopped and generate a scan clock signal based on the determination that the one or more clock signals have been stopped. The test control circuitry is further configured to communicate the scan clock signal to the memory elements. The testing interface is configured to communicate test data from the memory elements. In one example, the test data is delimited with start and end marker elements. The semiconductor device is mounted to a circuit board and is communicatively coupled to communication pins of the circuit board.