Semiconductor Memory Device Heat Dissipation via Compressed Resin Member
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Solution Overview
Problem
As semiconductor devices increase in performance, they generate more heat, leading to potential degradation and reduced lifetime due to ineffective heat dissipation in existing semiconductor memory devices.
Innovation Solution
A semiconductor memory device design incorporating a flexible first heat conduction member made of synthetic resin material, such as silicone rubber, which is compressed between the control unit and the case to efficiently transport and dissipate heat generated in the control unit, reducing heat transfer to adjacent components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a semiconductor memory device is provided with a heat dissipation structure, then heat dissipation efficiency is improved, but device complexity increases
Solution Approach 1:
The case structure is designed to serve dual purposes: as the housing structure and as a heat dissipation component. The case includes a heat dissipation fin that extends from the case body, allowing the same structural element to perform both mechanical support and thermal management functions, thereby improving heat dissipation without significantly increasing device complexity
Solution Approach 2:
The heat dissipation fin is integrated with the case structure rather than being a separate component. The fin extends from the case body and is formed as part of the case, merging the housing and heat dissipation functions into a single integrated structure, thus avoiding additional complexity from separate heat dissipation components
2Speed
If processing speed of semiconductor devices is increased, then device performance is improved, but heat generation increases
Solution Approach 1:
The invention converts the harmful heat generated by high-speed processing into a manageable thermal flow path. The heat dissipation fin structure provides a dedicated pathway for heat to escape, transforming the problematic heat generation into a controlled thermal management process that supports continued high-performance operation
Solution Approach 2:
The heat dissipation solution extends into the vertical dimension with the fin structure that protrudes from the case. This three-dimensional heat dissipation approach adds a new dimension to thermal management, allowing heat to be dissipated not only through the case body but also through the extended fin surface area in the vertical direction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces heat-related degradation and extends the lifespan of the control unit and storage unit by improving heat dissipation, dispersing heat efficiently through the case, thereby maintaining device performance.
Implementation Method 1
The first heat conduction member is disposed between the control unit and the case and covers the control unit in a state in which the first heat conduction member is held between and compressed by the control unit and the case
Data Source
AI summary
According to one embodiment, a semiconductor memory device includes a case, a first substrate, an element, and a first heat conduction member. The first substrate is provided in the case and includes a first face. The element is provided on the first face. The first heat conduction member is disposed at least between the element and the case. The element includes a second substrate, a control unit, and a storage unit. The second substrate includes a second face attached to the first face and a third face located opposite to the second face. The control unit and the storage unit are provided on the third face. The first heat conduction member covers the third face and the control unit and is disposed in a state in which the first heat conduction member is held between and compressed by the third face, the control unit, and the case.