Memory Device With Integrated M.2 and PCIE Connectors
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Solution Overview
Problem
Conventional M.2 interface memory cards require an adapter card to connect to a PCIE slot, increasing commodity costs due to bundling demands.
Innovation Solution
A memory device with integrated M.2 and PCIE connectors on a single substrate, eliminating the need for an adapter card by arranging connectors and memory chips in a specific configuration to optimize space and connectivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If an adapter card is used to connect M.2 interface memory card to PCIE slot, then connectivity between different interfaces is achieved, but device complexity and commodity cost increase
Solution Approach 1:
The patent integrates both M.2 interface connector and PCIE interface connector directly onto a single substrate, merging the functions that previously required separate components (memory card + adapter card). This eliminates the need for an adapter card while maintaining connectivity between different interface standards, thereby reducing device complexity without sacrificing adaptability.
Solution Approach 2:
The substrate is designed to host multiple interface connectors (M.2 and PCIE) simultaneously, making it universally compatible with different interface standards. This multi-functional design allows the memory device to directly interface with various slots without requiring additional adapter components.
2Adaptability or versatility
If an adapter card is bundled with M.2 interface memory card, then interface compatibility is ensured, but commodity cost increases
Solution Approach 1:
By combining both M.2 and PCIE connectors on one substrate, the patent eliminates the need to bundle separate adapter cards with M.2 memory cards. This integration reduces the quantity of components that need to be manufactured, packaged, and distributed, thereby reducing commodity costs while maintaining interface compatibility.
3Area of stationary object
If connectors and memory chips are arranged on substrate, then space utilization is optimized, but manufacturing precision requirements increase
Solution Approach 1:
The patent utilizes both the first surface and second surface of the substrate for mounting components. Memory chips are arranged on the first surface while interface connectors are positioned on the second surface, effectively using three-dimensional space rather than confining all components to a single two-dimensional plane. This dimensional approach optimizes substrate space utilization and reduces the density of component placement, thereby lowering manufacturing precision requirements.
Data Source
AI summary
A memory device is provided. The memory device includes a substrate, a first interface connector, a second interface connector and a plurality of memory chips. The substrate includes a first edge, a second edge, a third edge and a fourth edge. The first interface connector is disposed on the first edge, wherein the first interface connector includes a plurality of first edge-board contacts, and the first edge-board contacts extend toward a first direction. The second interface connector is disposed on the second edge, the second interface connector includes a plurality of second edge-board contacts, and the second edge-board contacts extend toward a second direction. The memory chips are disposed on the substrate, wherein the second interface connector is located between the memory chips and the first interface connector in the first direction.