Memory Device Liquid Cooling Heat Dissipation
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Solution Overview
Problem
The increased power requirements of solid-state disks for higher storage capacity and transmission speed lead to elevated operating temperatures, which are not effectively managed by conventional cooling methods, restricting storage capacity and posing safety and lifespan risks.
Innovation Solution
A memory device with an integrated cooling unit that utilizes a thermally connected housing and working fluid to dissipate heat, featuring a heat conductive structure and fluid path for efficient heat transfer, allowing the working fluid to absorb or transport heat away from the device, potentially using water or other fluids with temperature stabilizing abilities.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If power to the solid-state disk is increased to meet storage capacity and transmission speed requirements, then storage capacity and transmission speed are improved, but operating temperature increases and safety and lifespan are compromised
Solution Approach 1:
A working fluid is introduced as an intermediary substance between the heat source (memory module) and the external environment. The fluid absorbs heat through infusion holes and transports it away from the device, enabling high power operation while maintaining safety through active heat removal rather than passive air cooling
Solution Approach 2:
The patent employs a liquid cooling system where working fluid circulates through the device housing via infusion holes and flow paths. This hydraulic approach replaces conventional air cooling with liquid-based heat transport, enabling more efficient heat removal at higher power levels while maintaining reliable operation
2Productivity
If power to the solid-state disk is increased to meet storage capacity and transmission speed requirements, then storage capacity and transmission speed are improved, but operating temperature increases and lifespan is compromised
Solution Approach 1:
The working fluid serves as a thermal intermediary that continuously removes heat from the memory module through the housing walls. This active heat management enables sustained high-power operation for transmission speed while preventing thermal degradation that would otherwise reduce device lifespan
Solution Approach 2:
The system changes the thermal management parameter from passive air cooling to active liquid cooling. By introducing working fluid circulation through infusion holes and flow paths, the heat removal capability is enhanced, allowing higher operating temperatures that support faster transmission speeds while maintaining acceptable lifespan through controlled thermal conditions
3Device complexity
If conventional cooling methods are used, then device simplicity is maintained, but heat dissipation is insufficient and power is restricted to 25 Watts
Solution Approach 1:
Rather than adding complex active cooling components like fans or heat sinks, the patent uses the working fluid as a simple intermediary that leverages the existing housing structure. Fluid circulates through infusion holes in the housing walls, using the housing itself as the heat exchange surface, thereby achieving enhanced cooling with minimal additional complexity
Solution Approach 2:
The device housing serves multiple functions: it provides structural enclosure and simultaneously acts as the heat exchange surface for thermal management. The working fluid interacts with the housing walls to remove heat, eliminating the need for separate cooling components and maintaining device simplicity while enabling higher power operation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution effectively manages heat dissipation, preventing rapid temperature rises, enhancing safety and lifespan, and enabling increased power and capacity to meet stringent storage demands.
Implementation Method 1
some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid
Implementation Method 2
The cooling unit is thermally connected to the device housing to dissipate some of the heat
Data Source
AI summary
A memory device includes a device housing, a memory module, and a cooling unit. The memory module is disposed in the device housing, wherein the memory module generates heat, and the heat is transmitted to the device housing. The cooling unit is thermally connected to the device housing to dissipate some of the heat. The cooling unit includes a unit housing and a working fluid. An interior space is formed in the unit housing. The working fluid is disposed in the interior space, wherein some of the heat travels from the device housing, passes through the unit housing, and is transmitted to the working fluid.