Memory Device Power Management via Provider Dies
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Solution Overview
Problem
In memory devices, the inclusion of multiple power management circuits on each memory die leads to inefficiencies, increased size, and reduced storage capacity due to the space occupied by these circuits.
Innovation Solution
A subset of memory dies, referred to as provider memory dies, supplies operating voltages to other memory dies, allowing the recipient memory dies to omit or reduce their power management circuits, thereby reducing size and increasing storage capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If multiple power management circuits are included on each memory die, then each memory die can independently manage its own power, but the die size increases and storage capacity decreases due to space occupied by these circuits
Solution Approach 1:
Multiple memory dies are combined into a memory device where they share common power management circuits. The power management circuits are implemented at the memory device level rather than on each individual memory die, allowing recipient memory dies to omit these circuits and use the freed die area for additional memory cells, thereby increasing storage capacity while maintaining independent power management capability through the shared circuits.
2Reliability
If multiple power management circuits are included on each memory die, then each memory die has full power control, but manufacturing complexity and cost increase
Solution Approach 1:
The patent merges the power management functionality from individual memory dies into shared circuits at the memory device level. This consolidation reduces the total number of power management circuits needed, simplifying the manufacturing process and reducing costs while still providing each memory die with the necessary power control capability through the shared infrastructure.
3Area of moving object
If power management circuits are removed from recipient memory dies, then die area is reduced and storage capacity increases, but power supply coordination becomes more complex
Solution Approach 1:
The patent introduces a controller as an intermediary component that manages the shared power management circuits and coordinates power supply to multiple recipient memory dies. This controller handles the complexity of power distribution, voltage regulation, and power sequencing, thereby simplifying the overall system architecture and enabling recipient memory dies to omit power management circuits while maintaining proper power supply coordination.
Data Source
AI summary
Methods, systems, and devices for memory device power management are described. An apparatus may include a memory die that includes a power management circuit. The power management circuit may provide a voltage for operating one or more memory dies of the apparatus based on a supply voltage received by the memory die. The second voltage may be distributed to the one or more other memory dies in the apparatus.