Memory Dice Arrangement for Signal Reliability Optimization
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Solution Overview
Problem
Non-uniform signal reliability across memory devices due to process variations and environmental factors leads to degraded performance, with existing solutions being costly and not aligned with industry standards.
Innovation Solution
Memory dice are arranged within a memory device based on determined signal reliability characteristics, with higher reliability dice placed in positions farther from the memory controller and lower reliability dice in positions closer to the controller, considering physical signal routing paths and topology.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory dice are arranged in conventional positions without considering signal reliability, then manufacturing is simpler, but signal reliability becomes non-uniform and performance degrades
Solution Approach 1:
The patent measures signal reliability characteristics of each memory die before assembly and determines optimal positions in advance. This preliminary characterization and planning enables the subsequent arrangement to achieve uniform signal reliability across the memory device, resolving the contradiction between reliability improvement and arrangement complexity.
2Productivity
If memory dice are arranged based on signal reliability characteristics, then performance improves, but manufacturing process becomes more complex
Solution Approach 1:
The patent performs signal reliability measurement and position determination as preliminary steps before the actual memory device assembly. By characterizing each die's signal properties in advance and pre-determining optimal positions, the manufacturing process integrates smoothly without requiring complex real-time adjustments during assembly.
Solution Approach 2:
The patent changes the arrangement parameter from fixed conventional positions to optimized positions based on measured signal reliability characteristics. This parameter optimization improves performance by ensuring uniform signal distribution while the measurement and calculation processes remain integrated into standard manufacturing workflows.
3Reliability
If higher reliability dice are placed farther from controller, then signal reliability uniformity improves, but signal routing complexity increases
Solution Approach 1:
The patent applies local quality optimization by assigning specific memory dice to specific positions based on their individual signal reliability characteristics. Each die's position is optimized for its local signal environment, with higher reliability dice placed in positions farther from the controller where signal degradation is more pronounced, achieving overall uniformity across the device.
Data Source
AI summary
A method includes determining, for a plurality of memory dice, a signal reliability characteristic and ranking the plurality of memory dice based, at least in part, on the determined reliability characteristics. The method can further include arranging the plurality of memory dice to form a memory device based, at least in part, on the ranking.