Memory Die Age Tracking via Aging Bins for Reflow Soldering
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional memory devices are unable to track the impact of reflow soldering processes on the data integrity of preloaded data stored on memory dies, particularly in applications like embedded, mobile, and automotive markets, where charge loss due to reflow soldering affects the lifespan and readability of stored data.
Innovation Solution
Implementing age tracking of physical memory locations on memory dies using aging bins, which allow for determining the remaining lifespan, voltage level thresholds, and refresh criteria for physical memory locations, enabling optimization of read offsets and data retention by associating charge loss values with specific voltage levels and reflow cycles.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If reflow soldering processes are applied to memory dies, then memory devices can be manufactured and assembled, but charge loss occurs affecting data integrity and lifespan of preloaded data
Solution Approach 1:
The patent applies preliminary action by performing age tracking and charge loss assessment before the reflow soldering process. The system determines the age of physical memory locations and establishes voltage level thresholds and refresh criteria in advance, so that when reflow soldering occurs and causes charge loss, the data integrity can be maintained through pre-established parameters.
2Reliability
If age tracking is implemented using aging bins, then data integrity and lifespan can be monitored, but device complexity increases
Solution Approach 1:
The patent applies universality by making the aging bins serve multiple functions. The same aging bins that track memory location age are also used to determine voltage level thresholds, refresh criteria, and charge loss values. This multi-functional approach allows comprehensive monitoring of data integrity without adding separate dedicated structures for each function.
3Duration of action of stationary object
If refresh criteria are established based on charge loss values, then data retention is improved, but manufacturing precision requirements increase
Solution Approach 1:
The patent applies dynamics by making the refresh criteria adaptive rather than static. The refresh criteria are established based on determined charge loss values and age tracking data, allowing the system to dynamically adjust refresh operations according to the actual condition of memory locations. This dynamic approach compensates for variations in manufacturing precision by responding to actual charge loss measurements.
Data Source
AI summary
Various embodiments enable age tracking of one or more physical memory locations (e.g., physical blocks) of a memory die, which can be from part of a memory device. In particular, various embodiments provide age tracking of one or more physical memory locations of a memory die (e.g., memory integrated circuit (IC)) using one or more aging bins on the memory die, where each aging bin is associated with a different set of physical memory locations of the memory die. By use of an aging bin for a set of physical memory locations, various embodiments can enable a processing device that interacts with a memory die, after the memory die has been subjected to one or more reflow soldering processes, to determine how much the set of physical memory locations have aged after the one or more reflow soldering processes.