Pre-Stacked Memory Die Bonding for Reusable Interface Assembly
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Solution Overview
Problem
Existing semiconductor fabrication techniques result in inefficient use of resources and increased electronic waste due to the customization of interface dies for specific applications, making unused semiconductor packages unusable for other applications.
Innovation Solution
Fabricate semiconductor devices with pre-stacked memory dies independent of an interface die, bonding memory dies to a carrier and forming dielectric material around them, allowing for subsequent bonding with different interface dies.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If interface dies are customized for specific applications, then application-specific performance is improved, but resource utilization efficiency deteriorates and electronic waste increases
Solution Approach 1:
The patent divides the semiconductor system into separate functional modules: pre-stacked memory die stacks that can be independently fabricated and stored, and interface dies that are customized later. This segmentation allows the memory stacks to be produced in advance without being tied to specific applications, improving resource utilization while maintaining application-specific performance through later interface die customization.
Solution Approach 2:
The patent performs the memory die stacking operation in advance, before the interface die is determined or customized. The pre-stacked memory die stacks are fabricated, tested, and stored ready for future assembly with different interface dies. This preliminary action eliminates the need to customize the entire semiconductor package for each application, reducing electronic waste and improving resource utilization.
2Reliability
If interface dies are customized for specific applications, then application-specific performance is improved, but manufacturing efficiency deteriorates
Solution Approach 1:
The manufacturing process is segmented into two independent stages: (1) fabrication of pre-stacked memory die stacks, and (2) assembly with customized interface dies. This segmentation allows standardization of the memory stack fabrication process, improving manufacturing efficiency, while still enabling customization through the interface die assembly stage.
Solution Approach 2:
The memory die stacking operation is performed in advance during a standardized manufacturing process. The pre-stacked memory die stacks are then stored and can be efficiently assembled with different interface dies for various applications. This preliminary action eliminates the need for repeated customization of the entire semiconductor package, significantly improving manufacturing efficiency.
3Reliability
If semiconductor packages are customized for specific applications, then application suitability is improved, but adaptability deteriorates making unused packages unusable for other applications
Solution Approach 1:
The patent segments the semiconductor system into a universal pre-stacked memory die stack component and an application-specific interface die. The pre-stacked memory die stacks are designed to be application-agnostic and can be assembled with different interface dies to suit various applications. This segmentation maintains application suitability while dramatically improving adaptability and reusability.
Solution Approach 2:
The pre-stacked memory die stacks are designed as universal components that can interface with multiple different types of interface dies for various applications. This multi-functionality allows the same memory die stack to be reused across different applications by simply changing the interface die, thereby maintaining application suitability while improving adaptability and reducing electronic waste.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Improves manufacturing efficiency, reduces waste, and decreases environmental emissions by enabling adaptable semiconductor devices that can be used across various applications.
Implementation Method 1
bonding a set of memory dies to a carrier
Implementation Method 2
a dielectric material that electrically isolates the memory dies from each other and from the carrier
Data Source
AI summary
Methods, systems, and devices for memory die bonding in stacked semiconductor systems are described. A semiconductor device may be formed to include a stack of memory dies. Each memory die of the stack may be bonded with at least one other memory die of the stack. The semiconductor device may include a dielectric material in contact with a portion of a first memory die of the stack, with the dielectric material extending beyond at least one lateral boundary of the first memory die of the stack. The semiconductor device may also include one or more molding materials formed over the stack of memory dies and over the dielectric material, with the one or more molding materials spanning a lateral dimension of the dielectric material and in contact with a portion of at least one memory die of the stack.