Memory Die On-Die Heating for Cold-Temperature Reliability

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Solution Overview

Problem

Memory systems face performance issues due to temperature fluctuations, leading to non-compliance with operational thresholds when operating in different temperature environments, which can be exacerbated by cold or extreme temperature conditions.

Innovation Solution

Implementing an on-die heater controlled by temperature sensors and controllers to maintain the memory system's temperature within a specified range by activating or deactivating the heater based on temperature thresholds, ensuring optimal performance across varying environmental conditions.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of energy

If the memory system operates in cold temperature environments, then energy consumption is reduced, but performance reliability deteriorates due to non-compliance with operational thresholds

Engineering Contradiction:
Improveenergy consumptionVSAvoidperformance reliability
Core Design Contradiction:
Loss of energyVSReliability

Solution Approach 1:

The patent applies parameter changes by dynamically adjusting the temperature parameter of the memory system through on-die heating. When the temperature sensor detects that the memory die temperature falls below the first threshold, the controller activates the heater to increase the temperature to at least the second threshold, ensuring the system operates within reliable temperature ranges while allowing energy-efficient operation in cold environments when heating is not required

Inventive Principle:
Principle #35Parameter changes

2Adaptability or versatility

If the memory system operates in extreme temperature conditions, then adaptability to environmental conditions is improved, but operational stability deteriorates due to temperature fluctuations

Engineering Contradiction:
Improveadaptability to temperature environmentsVSAvoidoperational stability
Core Design Contradiction:
Adaptability or versatilityVSStability of the object's composition

Solution Approach 1:

The patent implements feedback control through a closed-loop temperature management system. The temperature sensor continuously monitors the memory die temperature and provides feedback to the controller, which adjusts the heater activation accordingly. This feedback mechanism maintains operational stability by preventing temperature fluctuations that would occur in extreme environments, while still allowing the system to adapt to various temperature conditions through intelligent control

Inventive Principle:
Principle #23Feedback

3Stability of the object's composition

If the heater is activated to maintain temperature, then operational stability is improved, but energy consumption increases

Engineering Contradiction:
Improvetemperature stabilityVSAvoidenergy consumption
Core Design Contradiction:
Stability of the object's compositionVSLoss of energy

Solution Approach 1:

The patent applies periodic action through threshold-based heater control. The heater is activated only when the temperature sensor detects that the memory die temperature falls below the first threshold, and deactivated when the temperature reaches the second threshold. This periodic on-off control maintains temperature stability within the operational range while minimizing energy consumption by avoiding continuous heater operation

Inventive Principle:
Principle #19Periodic action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The on-die heating system stabilizes the memory system's temperature, enhancing performance reliability and extending the lifespan of electronic devices by reducing the likelihood of operational failures due to temperature extremes.

Implementation Method 1

activating, while the memory system is in operation and based at least in part on the temperature associated with the memory die being equal to or less than a first threshold, a heater located on the memory die, the activating increasing the temperature associated with the memory die

Methodology Applied
Scientific EffectResistive heating: Joule Heating

Data Source

PatentUS20250362725A1On-die heating during memory die operation
Publication Date: 2025.11.27 MICRON TECHNOLOGY INC
  • US20250362725A1 patent drawing
  • US20250362725A1 patent drawing
  • US20250362725A1 patent drawing

AI summary

Methods, systems, and devices for on-die heating during memory die operation are described. A memory system may be operable to monitor a temperature associated with a memory die of the memory system. Further, the memory system may be operable to activate, while the memory system is in operation and based on the temperature associated with the memory die being equal to or less than a first threshold, a heater located on the memory die and deactivate, while the memory system is in operation and based on the temperature associated with the memory die being equal to or greater than a second threshold that is greater than the first threshold, the heater located on the memory die.