Stacked Memory Die Power Switching for Standby Current Isolation

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Solution Overview

Problem

Existing semiconductor memory devices face challenges in efficiently identifying and isolating memory dies with high standby currents, leading to increased power consumption and difficulty in failure analysis due to shared power supply lines.

Innovation Solution

The semiconductor memory device employs independently controllable switch elements for each memory die, allowing separate application of power supply voltage, enabling identification and isolation of memory dies with high standby currents.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Device complexity

If multiple memory dies share common power supply lines, then device complexity is reduced, but identification and isolation of memory dies with high standby currents becomes difficult

Engineering Contradiction:

Improvepower supply line structureVSAvoidstandby current identification

Core Design Contradiction:

Device complexityVSDifficulty of detecting and measuring

Solution Approach 1:

The patent divides the common power supply line into separate power supply lines for each memory die by introducing switch elements. This segmentation allows independent control of power supply to each memory die, enabling precise identification and isolation of defective memory dies without increasing overall system complexity

Inventive Principle:

Principle #1Segmentation

2Ease of manufacture

If multiple memory dies share common power supply lines, then manufacturing simplicity is maintained, but power consumption cannot be optimized

Engineering Contradiction:

Improvepower supply configurationVSAvoidstandby power consumption

Core Design Contradiction:

Ease of manufactureVSUse of energy by moving object

Solution Approach 1:

The patent introduces switch elements that can dynamically control the power supply state of each memory die independently. This dynamic control enables the system to optimize power consumption by isolating memory dies with high standby currents while maintaining manufacturing simplicity through a modular switch integration approach

Inventive Principle:

Principle #15Dynamics

3Difficulty of detecting and measuring

If independently controllable switch elements are added for each memory die, then identification and isolation of high standby current memory dies is improved, but device complexity increases

Engineering Contradiction:

Improvestandby current measurementVSAvoidswitch element control structure

Core Design Contradiction:

Difficulty of detecting and measuringVSDevice complexity

Solution Approach 1:

The switch elements serve multiple functions: they enable independent power supply control, facilitate standby current measurement, and allow isolation of defective memory dies. This multi-functionality justifies the added complexity by eliminating the need for separate testing equipment and procedures

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS12563750B2Semiconductor memory device and method of manufacturing the same

Publication Date: 2026.02.24 KIOXIA CORP

AI summary

A semiconductor memory device includes a first memory die, a second memory die disposed above the first memory die via adhesives, a first wiring connected to the first memory die, and configured to apply a power supply voltage to the first memory die, a first switch element connected to the first wiring, a second wiring connected to the second memory die, and configured to apply the power supply voltage to the second memory die, a second switch element connected to the second wiring, and a third wiring configured to electrically connect to the first wiring via the first switch element, and configured to electrically connect to the second wiring via the second switch element. The first switch element and the second switch element are independently controllable.