Memory Die Self-Heating for Cross-Temperature Read Reliability
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Solution Overview
Problem
Cross-Temperature variations significantly degrade the reliability of NAND memory arrays, requiring substantial read window budget allocation for temperature compensation, which can be costly and time-consuming to improve.
Innovation Solution
Implementing active thermal compensation by activating a heater within the memory device to adjust the temperature of memory die to match the temperature at which data was written, using conductive channels or resistive heaters to bring the read temperature closer to the write temperature during operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If process improvements are implemented to reduce Cross-Temp loss, then reliability is improved, but manufacturing cost and time increase
Solution Approach 1:
The memory device uses its own existing conductive channels (pillars) to generate heat through self-heating mode, eliminating the need for external heating equipment or complex manufacturing processes. The device serves its own thermal compensation needs using internal resources.
Solution Approach 2:
The invention changes the operational parameters of existing conductive channels by activating them in self-heating mode during read operations. This parameter change (from normal operation to self-heating mode) enables temperature compensation without adding new components or manufacturing steps.
2Measurement precision
If read window budget is allocated for Cross-Temp loss, then reading accuracy is maintained, but available voltage window for other purposes is reduced
Solution Approach 1:
The system performs preliminary heating of the memory device before read operations to pre-compensate for temperature effects. This preliminary action ensures that the memory device is at the optimal temperature for reading, reducing the need for large read window budgets during actual read operations.
Solution Approach 2:
The system monitors temperature conditions and adjusts heating accordingly, creating a feedback loop that optimizes the balance between reading accuracy and voltage window availability. This dynamic adjustment allows the system to maintain precision while preserving voltage headroom for other operations.
3Adaptability or versatility
If memory device operates at varying temperatures, then adaptability to different environments is improved, but reading accuracy degrades
Solution Approach 1:
The system dynamically adjusts its operational mode based on temperature conditions. By detecting temperature variations and switching to self-heating mode when needed, the system maintains reading accuracy across different environmental conditions while preserving its environmental adaptability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances data reading accuracy by reducing temperature-related inaccuracies and maintaining a reduced temperature range, thereby improving memory device reliability without significant additional cost or time investment.
Implementation Method 1
activating a heater within the memory device to adjust the temperature of memory die to match the temperature at which data was written, using conductive channels or resistive heaters
Data Source
AI summary
An apparatus and/or system is described including a memory device or a controller for the memory device to perform heating of the memory device. In embodiments, a controller is to receive a temperature of the memory device and determine that the temperature is below a threshold temperature. In embodiments, the controller activates a heater for one or more memory die to assist the memory device in moving the temperature towards the threshold temperature, to assist the memory device when reading data. In embodiments, the heater comprises a plurality of conductive channels included in the one or more memory die or other on-board heater. Other embodiments are disclosed and claimed.