Memory Die Temperature Sensing via Internal Sensor and Control Logic
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Solution Overview
Problem
Existing memory systems, such as flash memory, face challenges in accurately monitoring the internal temperature of memory dies, leading to potential malfunction and reduced data retention due to high temperatures, as external temperature sensors may not accurately represent the operation temperature inside the memory die.
Innovation Solution
Incorporating a temperature sensor and a temperature monitoring pin within the memory die, coupled with a control logic unit that compares the sensed temperature with threshold values to output a temperature status, allowing real-time monitoring by the host controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If a temperature sensor is placed outside the memory die, then the device complexity is reduced, but the measurement precision of the internal temperature is insufficient
Solution Approach 1:
The temperature sensor is nested inside the memory die structure, with the sensor integrated within the internal architecture of the memory device. This nesting approach allows the sensor to be positioned close to the heat-generating components while maintaining a compact overall design, thereby achieving accurate internal temperature measurement without significantly increasing external device complexity
Solution Approach 2:
The temperature sensor serves multiple functions: it measures internal temperature for monitoring purposes, provides data for thermal management algorithms, and enables adaptive performance adjustment. By making the sensor multi-functional, the patent reduces the need for separate dedicated temperature monitoring systems, thereby managing device complexity while improving measurement precision
2Reliability
If continuous temperature monitoring is implemented inside the memory die, then the reliability of the memory system is improved, but the use of energy increases
Solution Approach 1:
The temperature monitoring is implemented periodically rather than continuously, with the control logic unit checking temperature at specific intervals or under specific conditions (e.g., during write operations, at defined time points). This periodic sampling approach maintains system reliability by detecting temperature trends and thresholds while significantly reducing the energy consumption associated with constant monitoring
Solution Approach 2:
The control logic unit uses feedback from temperature readings to dynamically adjust monitoring frequency and system operations. When temperatures are within normal ranges, monitoring can be less frequent; when approaching thresholds or during high-stress operations, monitoring intensity increases. This feedback-driven approach ensures reliability while optimizing energy usage based on actual thermal conditions
3Adaptability or versatility
If multiple temperature monitoring pins are provided, then the adaptability of the memory system is improved, but the device complexity increases
Solution Approach 1:
The system provides dynamic temperature monitoring capabilities where the monitoring pins can be selectively activated or configured based on operational needs. The control logic unit can dynamically select which pins to use, adjust their functions, or combine them for different monitoring scenarios, allowing the system to adapt to various applications without requiring all pins to be permanently configured for temperature monitoring
Solution Approach 2:
The temperature monitoring function is segmented across multiple pins, each capable of independent or coordinated operation. This segmentation allows different pins to monitor different aspects of thermal conditions or serve different functional blocks within the memory die, providing adaptability while distributing the complexity across modular pin assignments rather than requiring a monolithic complex configuration
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enables accurate internal temperature sensing within the memory die, preventing malfunctions and extending data retention by allowing for timely temperature status monitoring and threshold-based alerts.
Implementation Method 1
a temperature sensor, arranged in the memory die for sensing an operation temperature in the memory die
Data Source
AI summary
A method for sensing temperature in memory die, memory die and memory with temperature sensing function are provides. The memory die includes at least one temperature monitoring for outputting a temperature status in the memory die; a temperature sensor, arranged in the memory die for sensing an operation temperature in the memory die; and a control logic unit, coupled to the temperature sensor for receiving the operation temperature and coupled to the temperature monitoring pin. The control logic unit compares the operation temperature and a threshold value received from outside of the memory die to generate a comparison result, and outputs the temperature status through the temperature monitoring according to the comparison result.