Memory Die Temperature Ranking for Zone Allocation
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Solution Overview
Problem
Conventional memory sub-systems fail to manage temperature effectively during zone creation, leading to increased temperature in memory device dies, which results in write amplification and reduced performance.
Innovation Solution
A memory sub-system that monitors die temperatures and selects the coolest available die for zone creation, maintaining optimal operating temperatures and reducing cooling costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If zone creation is performed without temperature monitoring, then zone creation speed is improved, but temperature control deteriorates
Solution Approach 1:
The system performs preliminary temperature monitoring and die selection before zone creation begins. By pre-identifying suitable cool dies and preparing the temperature management strategy in advance, the system can create zones without causing temperature spikes, thus maintaining both high productivity and temperature control.
Solution Approach 2:
The system continuously monitors die temperatures during zone creation and uses this feedback to dynamically adjust zone allocation decisions. When a die approaches its temperature threshold, the system receives feedback and redirects subsequent zone creations to alternative cooler dies, preventing temperature deterioration while maintaining creation speed.
2Productivity
If zones are allocated to hottest dies, then zone allocation efficiency is improved, but write amplification increases
Solution Approach 1:
Instead of uniformly allocating zones to the hottest dies for efficiency, the system applies local quality by selecting dies based on their specific temperature characteristics and operational state. Each die is evaluated individually, and zones are allocated to dies that locally satisfy both efficiency requirements and temperature constraints, preventing excessive write amplification.
Solution Approach 2:
The system changes the allocation parameter from purely efficiency-based (hottest dies) to a composite parameter that includes temperature thresholds and operational state. By modifying the selection criteria to consider multiple parameters, the system achieves efficient allocation while avoiding the write amplification that results from allocating to overheated dies.
3Temperature
If temperature monitoring is implemented, then temperature control is improved, but system complexity increases
Solution Approach 1:
The system implements self-service temperature monitoring where each die essentially monitors and reports its own temperature state. The controller uses straightforward threshold-based logic to make allocation decisions, avoiding complex control algorithms. This self-service approach provides effective temperature control while minimizing the added system complexity.
4Temperature
If cool dies are selected for zone creation, then temperature control is improved, but allocation time increases
Solution Approach 1:
The system performs preliminary identification and ranking of dies by temperature before zone allocation begins. By pre-sorting dies from coolest to hottest and maintaining this ordered list, the system can quickly select suitable cool dies during allocation without performing time-consuming searches, thus balancing temperature control with fast allocation.
Solution Approach 2:
The system dynamically maintains an ordered list of dies based on real-time temperature measurements. As temperatures change during operation, the ordering is updated efficiently. This dynamic approach allows the system to quickly identify suitable cool dies for zone creation without excessive allocation time, adapting to changing thermal conditions in real-time.
Data Source
AI summary
Respective temperature values for a plurality of dies of a memory device is obtained. Each respective temperature value is indicative of a temperature at a corresponding die of the plurality of dies of the memory device. The plurality of dies based on the respective temperature values, each die of the plurality of dies is ordered. A zone creation command directed to the memory device is received from a host. The zone creation command on the memory device on a die of the ordered plurality of dies is performed based on a temperature threshold.