Memory Die Thermal Throttling via Per-Die Temperature Sensors
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Solution Overview
Problem
Existing memory systems thermally throttle all memory dies when one die approaches its temperature limit, leading to sub-optimal performance as cooler dies are underutilized and unable to handle more write and read operations before reaching the limit.
Innovation Solution
Each memory die is equipped with its own temperature sensor, allowing the memory system to monitor and select which dies to perform memory access operations based on temperature, routing operations from hotter dies to cooler ones and individually throttling thermal access to prevent overheating.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal throttling is applied to all memory dies when one die approaches temperature limit, then overheating is prevented, but system performance is sub-optimally reduced
Solution Approach 1:
The patent segments the thermal management approach by applying thermal throttling individually to each memory die based on its own temperature sensor readings, rather than uniformly throttling all dies. This allows selective throttling of only those dies that are approaching temperature limits while maintaining full performance on cooler dies.
Solution Approach 2:
The patent implements local quality by making each memory die's thermal management independent and tailored to its specific temperature conditions. Each die has its own temperature sensor and throttling control, allowing localized thermal management that adapts to the specific thermal state of each die rather than applying a global throttling policy.
2Device complexity
If a single temperature sensor near DRAM is used to monitor hottest die, then device complexity is reduced, but temperature monitoring precision is insufficient
Solution Approach 1:
The patent segments the temperature monitoring function by placing individual temperature sensors on each memory die rather than using a single external sensor. This segmentation of sensing elements provides precise local temperature measurement for each die, eliminating the need for complex thermal modeling to infer temperatures of individual dies from a single sensor reading.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach optimizes performance by allowing memory access operations to continue on cooler dies while thermally throttling hotter ones, preventing overheating and improving overall system efficiency.
Implementation Method 1
Each memory die is equipped with its own temperature sensor, allowing the memory system to monitor and select which dies to perform memory access operations based on temperature
Data Source
AI summary
A memory system and method are provided for selecting memory dies for memory access operations based on memory die temperatures. The memory system has a plurality of memory dies, where each memory die has its own temperature sensor. In one embodiment, the memory system selects which memory dies to perform memory access operations in based on the temperatures of the memory dies. In another embodiment, a controller of the memory system selects which memory dies to thermal throttle memory access operations in based on the detected temperatures. In yet another embodiment, a temperature-aware media management layer module of the memory 1 system routes a memory access operation from a first memory die to a second memory die based on the temperatures of the memory dies.