Memory Heat Dissipation Unit With Segmented Clamping

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Solution Overview

Problem

Conventional memory heat dissipation clips face challenges in efficiently dissipating heat from memory chips due to poor design, inadequate clipping force, and difficulty in manufacturing, especially in narrow spaces, leading to potential chip damage and poor heat exchange efficiency.

Innovation Solution

A memory heat dissipation unit with a main body comprising first and second portions, each with heat-receiving sections that contact memory chips, and a connection portion with lateral edges, allowing for effective heat exchange and improved clipping force through optimized angles and surface configurations, enabling efficient heat transfer and dissipation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If conventional heat dissipation clips with inwardly inclined side surfaces are used, then heat dissipation function is provided, but insufficient clipping force results in poor contact with memory chips

Engineering Contradiction:

Improveheat dissipation efficiencyVSAvoidclipping force

Core Design Contradiction:

ReliabilityVSForce

Solution Approach 1:

The heat dissipation clip is divided into multiple independent clamping units, each capable of providing clamping force to individual memory chips. This segmentation allows each unit to be optimized for both contact pressure and heat transfer, resolving the contradiction between sufficient clipping force and effective heat dissipation.

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Different portions of the heat dissipation clip have different structural characteristics - some portions have inclined surfaces for initial contact, while other portions have substantially vertical surfaces for maintaining consistent clamping pressure. This local differentiation allows the clip to provide both adequate clipping force and reliable thermal contact across multiple chips.

Inventive Principle:

Principle #3Local quality

2Reliability

If multiple heat dissipation sheets are attached to lateral sides of memory chips, then heat dissipation capacity is improved, but mounting space becomes insufficient in narrow configurations

Engineering Contradiction:

Improveheat dissipation capacityVSAvoidmounting space

Core Design Contradiction:

ReliabilityVSArea of stationary object

Solution Approach 1:

The heat dissipation function and the clamping/retention function are merged into a single integrated clip structure. The same body that provides mechanical clamping force also serves as the thermal conduction path, eliminating the need for separate mounting space for additional heat dissipation sheets.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The heat dissipation clip performs multiple functions simultaneously: it provides mechanical retention for memory chips, applies uniform clamping pressure for thermal contact, and conducts heat away from the chips. This multi-functionality resolves the space conflict by consolidating heat dissipation capabilities into the retention structure itself.

Inventive Principle:

Principle #6Universality (Multi-functionality)

3Adaptability or versatility

If heat dissipation clips with complex bridging sections are used, then structural flexibility is improved, but manufacturing difficulty increases

Engineering Contradiction:

Improvestructural flexibilityVSAvoidmanufacturing complexity

Core Design Contradiction:

Adaptability or versatilityVSEase of manufacture

Solution Approach 1:

The clip design uses repeated, identical clamping unit patterns that can be manufactured using stamping or molding processes. This replication of standardized units provides structural flexibility for accommodating multiple chips while maintaining manufacturing simplicity through consistent, repeatable geometry.

Inventive Principle:

Principle #26Copying

Solution Approach 2:

The clip structure achieves flexibility through controlled geometric parameters - specifically, the inclination angles and vertical sections can be adjusted to match different memory chip configurations without changing the fundamental manufacturing process. This allows adaptability while keeping production straightforward.

Inventive Principle:

Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution provides enhanced heat exchange efficiency, prevents chip damage from overheating, and allows for easier mounting in narrow spaces, improving overall heat dissipation performance and extending the service life of memory components.

Implementation Method 1

the first and the second heat-receiving section are respectively in contact with at least one memory chip to exchange heat with the chips

Methodology Applied

Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS10842014B2Memory heat dissipation unit

Publication Date: 2020.11.17 WU TUNG YI

AI summary

A memory heat dissipation unit is disclosed. The memory heat dissipation unit includes a main body having a first portion, a second portion and a connection portion having two lateral edges separately connected to the first and the second portion. The first and the second portion have at least one first heat-receiving section and at least one second heat-receiving section formed thereon, respectively; and the first and the second heat-receiving section are correspondingly in contact with at least one memory chip each to exchange heat with the chips and accordingly cool the same.