Memory Module Enclosure With Fins for Heat and Vibration Reliability
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Solution Overview
Problem
Memory devices used in various electronic devices, such as automobiles and drones, face challenges with mechanical reliability due to exposure to vibrations, accidents, and high temperatures, which can lead to malfunction and reduced performance.
Innovation Solution
The proposed solution involves a memory device design with an enclosure assembly that includes a module board and a memory connector, where the enclosure assembly features a first and second enclosure with main covers that have base parts and fins protruding outward, providing enhanced mechanical strength and heat capacity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the memory device uses a conventional enclosure design, then the device complexity is low, but the mechanical strength and heat capacity are insufficient for harsh environments
Solution Approach 1:
The patent transitions from a conventional planar enclosure to a three-dimensional structure with fins protruding from the main cover. These fins extend in the vertical dimension, increasing the surface area for heat dissipation and providing additional structural reinforcement without significantly complicating the assembly process. The fins are integrated into the main cover as a single piece, maintaining manufacturing simplicity while achieving enhanced mechanical and thermal performance.
Solution Approach 2:
The enclosure is divided into functional segments: the main cover providing structural support, the fins providing heat dissipation surface area, and the clamping holes providing connection points. This segmentation allows each component to be optimized for its specific function while maintaining overall structural integrity. The modular design enables independent optimization of heat dissipation and mechanical strength without increasing overall complexity.
2Temperature
If the memory device uses a conventional enclosure design, then the manufacturing process is simple, but the heat capacity is insufficient to prevent malfunction in high temperature environments
Solution Approach 1:
The fin structure adds vertical dimension to the heat dissipation surface, transforming a two-dimensional planar cover into a three-dimensional heat exchange structure. This dramatically increases the surface area available for heat dissipation without requiring multiple separate components or complex assembly procedures. The fins can be formed in a single molding or machining operation, maintaining manufacturing simplicity.
Solution Approach 2:
The patent employs materials with high thermal conductivity for the main cover and fins, such as aluminum alloys or copper-based materials. These composite structures combine structural integrity with superior heat dissipation properties. The material selection enables effective heat management in high-temperature environments while maintaining ease of manufacturing through conventional metal forming processes.
3Reliability
If the memory device lacks protective features, then the device complexity is low, but the reliability under vibration and shock is poor
Solution Approach 1:
The fin structures and reinforced main cover act as preemptive protective elements that absorb and distribute mechanical stresses from vibrations and shocks before they can reach sensitive internal components. The extended fin surfaces provide additional structural reinforcement that cushions against external impacts, protecting the memory module and connector assembled within the enclosure.
Solution Approach 2:
The patent incorporates curved or rounded fin geometries rather than sharp angular structures. These curved surfaces better distribute stress concentrations that arise during vibration and shock events, preventing stress localization that could lead to fatigue failures. The smooth transitions in the fin structures reduce stress concentration points while maintaining structural reinforcement.
Data Source
AI summary
A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.