Memory Module Enclosure Assembly for Heat and Shock Reliability
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Solution Overview
Problem
Memory devices, such as SSDs, face challenges with mechanical reliability due to exposure to vibrations, shocks, and high temperatures in environments like automobiles and aircraft, which can lead to malfunction and mechanical failure.
Innovation Solution
The memory device is designed with a sealed enclosure assembly that includes thermal interface materials and phase change materials to enhance heat capacity and mechanical strength, featuring a specific fastening structure with inter-device fastening pillars and a thermal gap filler to absorb shocks and dissipate heat effectively.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If the memory device is exposed to high temperature environments, then the operational reliability deteriorates, but adding thermal management components increases device complexity
Solution Approach 1:
The housing is designed to integrate multiple functions: structural protection, thermal management through phase change materials, and mechanical shock absorption through elastic fixing units. This merging of functions improves reliability without proportionally increasing device complexity.
Solution Approach 2:
The housing incorporates phase change materials that undergo phase transitions at specific temperatures to absorb excess heat. This composite material approach provides passive thermal management, maintaining operational reliability in high-temperature environments without requiring active cooling systems.
2Reliability
If the memory device is subjected to external shocks and vibrations, then mechanical reliability deteriorates, but adding protective structures increases device complexity
Solution Approach 1:
The elastic fixing units are pre-configured to provide cushioning against mechanical shocks and vibrations. These units absorb impact energy before it reaches the substrate, maintaining mechanical reliability without requiring complex active protection systems.
Solution Approach 2:
The elastic fixing units function as flexible elements that deform under shock loads and return to their original position. This flexibility provides mechanical protection while maintaining a relatively simple device structure.
3Temperature
If thermal interface materials and phase change materials are added to enhance heat capacity, then heat dissipation improves, but device complexity increases
Solution Approach 1:
The housing structure is merged with thermal management functions by incorporating phase change materials directly into the housing. This integration improves heat dissipation capability while avoiding the need for separate, complex cooling systems.
Solution Approach 2:
Phase change materials are utilized to absorb and dissipate heat through phase transitions (e.g., solid to liquid). This passive thermal management approach enhances heat dissipation capability without requiring active cooling mechanisms, thereby limiting the increase in device complexity.
4Strength
If a sealed enclosure assembly with fastening structure is implemented to improve mechanical strength, then resistance to external shocks improves, but device complexity increases
Solution Approach 1:
The housing is divided into a first housing part and a second housing part that can be separately assembled and fastened. This segmentation allows for simplified manufacturing and assembly while providing a sealed enclosure that resists external shocks and vibrations.
Solution Approach 2:
The fastening structure serves multiple functions: it seals the enclosure, provides mechanical strength, and anchors the elastic fixing units. This multi-functionality improves resistance to external shocks without proportionally increasing device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution provides improved mechanical reliability and heat dissipation, ensuring the memory device remains functional in harsh environments and maintains performance under external shocks and high temperatures.
Implementation Method 1
phase change materials to enhance heat capacity
Implementation Method 2
thermal interface materials to enhance heat capacity
Implementation Method 3
a fixing unit which has elasticity and is in contact with the substrate
Data Source
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AI summary
A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.