Memory Module Enclosure Assembly for Heat and Vibration Reliability
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Solution Overview
Problem
Memory devices, such as SSDs, face mechanical reliability issues due to exposure to vibrations and high temperatures, particularly in mobility-related electronic devices like automobiles and aircraft, which can lead to malfunction and mechanical failure.
Innovation Solution
A memory device design featuring an enclosure assembly with a dual-enclosure structure that includes clamping holes and inter-device fastening pillars, providing enhanced mechanical strength and heat capacity through thermal interface materials, phase change materials, and a sealed structure to protect against environmental stresses.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If the memory device uses a traditional single-enclosure structure, then the device complexity is low, but the mechanical strength and heat dissipation capacity are insufficient for harsh environments
Solution Approach 1:
The enclosure assembly is divided into multiple separate enclosures (first enclosure, second enclosure, third enclosure) instead of using a single monolithic structure. Each enclosure can be independently manufactured and assembled, allowing for optimized mechanical strength in each component while maintaining overall structural integrity through the sealed connections between them.
2Temperature
If the memory device uses a traditional single-enclosure structure, then the manufacturing process is simple, but the heat dissipation capacity is insufficient for high-temperature environments
Solution Approach 1:
The thermal management system is segmented across multiple enclosures, each with its own heat dissipation pathways. This allows heat to be distributed and dissipated through multiple surfaces and interfaces, increasing overall heat dissipation capacity while enabling modular manufacturing of each enclosure unit.
Solution Approach 2:
The multi-enclosure structure adds spatial dimensionality to heat dissipation by creating multiple external surfaces and thermal interfaces. Heat can be dissipated through multiple enclosures simultaneously, effectively utilizing three-dimensional space for thermal management rather than relying on a single enclosure surface.
3Reliability
If the memory device lacks protective sealing structures, then the ease of operation is high, but the reliability under vibration and shock is poor
Solution Approach 1:
The sealing structures are integrated into the enclosure assembly design, merging the protective function with the structural framework. The sealed connections between multiple enclosures create a unified protective barrier against vibrations and shocks while maintaining operational accessibility through designed interfaces.
Solution Approach 2:
The sealed enclosure structure provides preemptive protection against environmental stresses such as vibrations and shocks before they can affect the memory module. The multi-enclosure design with sealed connections creates a protective cushioning effect that absorbs and distributes mechanical stresses.
4Stability of the object's composition
If the memory device lacks fastening structures, then the ease of installation is high, but the stability under external shocks is poor
Solution Approach 1:
The fastening system is segmented into multiple fastening pillars distributed across the enclosure assembly. This allows the structure to be stabilized at multiple points against external shocks while maintaining ease of installation through modular fastening components that can be independently assembled.
Solution Approach 2:
Fastening pillars extend in the vertical dimension from the enclosure surfaces, providing three-dimensional anchoring points for securing the memory device. This adds vertical stability against shocks while maintaining simple horizontal alignment for installation.
Data Source
AI summary
A memory device and an electronic device is provided. The memory device may include a memory module including a module board and a memory connector located on one side of the module board, a first enclosure placed above the memory module and a second enclosure placed below the memory module, wherein the first enclosure includes a first main cover which covers upper faces of the module board and the memory connector, at least one clamping hole which penetrates the main cover at a position overlapping the memory connector, an inter-device fastening pillar protruding downward from a lower face of the first main cover, and a coupling hole which is located inside the inter-device fastening pillar on a plane and penetrates the inter-device fastening pillar and the main cover.