Memory Sub-System Enclosure With Vapor Chamber Hot-Spot Control
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Solution Overview
Problem
Memory sub-systems face thermal challenges due to unbalanced heat distribution, leading to potential data loss and damage from overheating, which existing thermal throttling mechanisms fail to adequately address.
Innovation Solution
Implementing a hybrid memory/storage sub-system with a PCB assembly secured between a heat spreader and a heat sink, utilizing a vapor chamber to thermally couple top and bottom enclosures, and employing fasteners and thermal gap pads to enhance heat transfer and balance temperature across both sides of the PCB.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If thermal throttling is implemented to prevent overheating, then data loss and damage are prevented, but processing speed is reduced
Solution Approach 1:
The patent applies preliminary action by pre-establishing a vapor chamber and heat spreader structure before thermal throttling becomes necessary. These thermal management components are built into the memory sub-system enclosure from the beginning, enabling proactive heat distribution and prevention of hot spots before temperature thresholds are reached, thus maintaining higher processing speeds without triggering thermal throttling.
Solution Approach 2:
The patent uses an intermediary approach by introducing a vapor chamber as a thermal mediator between heat generation sources and heat dissipation points. The vapor chamber acts as a thermal conduit that redistributes heat uniformly across the PCB, preventing localized overheating and allowing the system to operate at higher speeds without triggering thermal throttling.
2Temperature
If heat dissipation structures are added to manage thermal load, then temperature control is improved, but device complexity increases
Solution Approach 1:
The patent applies merging by integrating the vapor chamber, heat spreader, and enclosure structures into a unified thermal management system. These components are combined within the existing enclosure design, allowing multiple thermal functions to be achieved through integrated structures rather than separate add-on components, thus improving temperature control without proportionally increasing device complexity.
Solution Approach 2:
The patent implements multi-functionality by designing the vapor chamber and heat spreader to serve multiple purposes: heat distribution, hot spot prevention, and thermal balance across the PCB. These structures perform several thermal management functions simultaneously, improving temperature control while minimizing the need for additional specialized components.
3Ease of manufacture
If unbalanced heat distribution is allowed, then simpler design is maintained, but thermal efficiency decreases
Solution Approach 1:
The patent applies local quality by implementing targeted thermal management in specific high-heat-generation areas of the PCB. The vapor chamber and heat spreader are positioned to locally address hot spots rather than requiring uniform thermal management across the entire board. This localized approach maintains design simplicity while significantly improving thermal efficiency in critical areas.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design effectively balances heat transfer, increasing the amount of heat that can be generated before thermal throttling occurs, ensuring reliable operation and preventing overheating, thus enhancing the memory sub-system's thermal efficiency and reliability.
Implementation Method 1
utilizing a vapor chamber to thermally couple top and bottom enclosures
Implementation Method 2
utilizing a vapor chamber to thermally couple top and bottom enclosures
Implementation Method 3
a heat spreader and a heat sink, utilizing a vapor chamber to thermally couple top and bottom enclosures
Implementation Method 4
a heat spreader and a heat sink
Implementation Method 5
a heat spreader and a heat sink
Data Source
AI summary
Aspects of the present disclosure are directed to a memory sub-system with isothermal cooling of components. A PCB assembly may be secured between a heat spreader and a heat sink that are thermally coupled. The heat sink radiates heat absorbed from both sides of the PCB assembly. By connecting the heat spreader to the heat sink, heat is more effectively transferred from the side of the PCB assembly not directly connected to the heat sink. The PCB assembly may be secured between a top enclosure and a bottom enclosure. The top enclosure and the bottom enclosure may be thermally coupled using a vapor chamber. The vapor chamber pumps heat from a higher-temperature side of the PCB assembly to a lower-temperature side of the PCB assembly. By using the vapor chamber to thermally couple the top and bottom enclosures, creation of hot spots is avoided.