Memory Error Diagnosis via Temperature Logging
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Solution Overview
Problem
Memory devices, such as DIMMs, have a high warranty return rate due to temperature-induced errors, which are often undiagnosed as the manufacturing process struggles to replicate reported failures, leading to a high 'no fault found' rate.
Innovation Solution
A system that detects memory errors and logs temperature information using a baseboard management controller (BMC) with a poller to obtain and store temperature measurements, an error handler to write the highest measured temperature to non-volatile storage when an error occurs, and a processor to identify and log temperature-induced errors, allowing for diagnosis without accessing the computer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If memory devices are returned for warranty claims due to suspected errors, then potential faulty devices can be identified, but the manufacturing process cannot duplicate reported failures resulting in high 'no fault found' rate
Solution Approach 1:
The system performs preliminary temperature monitoring and error logging before the memory device is returned to manufacturing. Temperature sensors continuously monitor the memory device during operation, and when errors occur, the system proactively logs the temperature data and error codes in non-volatile storage on the memory module itself, preparing the evidence before the device leaves the customer site.
Solution Approach 2:
The patent introduces an intermediary logging system that acts as a mediator between the memory device and the manufacturing testing process. The Baseboard Management Controller (BMC) and memory device work together to capture and store temperature and error information, creating an intermediary record that bridges the gap between field operation conditions and manufacturing analysis capabilities.
2Measurement precision
If manufacturing performs extensive testing on returned memory devices, then potential faults can be detected, but the process is time-consuming and costly with high 'no fault found' rate
Solution Approach 1:
The system performs preliminary temperature monitoring and error logging before the memory device is returned to manufacturing. Temperature sensors continuously monitor the memory device during operation, and when errors occur, the system proactively logs the temperature data and error codes in non-volatile storage on the memory module itself, preparing the evidence before the device leaves the customer site.
Solution Approach 2:
The system implements feedback by continuously monitoring temperature and error conditions during memory device operation. When an error occurs, the system immediately feeds back the temperature reading and error code to the logging mechanism, creating a closed-loop system that captures critical diagnostic information in real-time without requiring extended post-return testing.
3Difficulty of detecting and measuring
If temperature monitoring is continuously performed, then temperature-induced errors can be diagnosed, but additional hardware and complexity are required
Solution Approach 1:
The Baseboard Management Controller (BMC) performs multiple functions including system management, event logging, and temperature monitoring. By utilizing the BMC's existing capabilities rather than adding dedicated monitoring hardware, the system achieves temperature-induced error detection while minimizing additional complexity. The memory device itself also serves dual purposes as both the component being tested and the storage medium for diagnostic data.
Solution Approach 2:
The memory device performs self-diagnosis by using its own integrated temperature sensor and non-volatile storage to monitor and record its own operational conditions. When errors occur, the memory device autonomously logs the temperature and error codes without requiring external monitoring equipment, enabling the device to service its own diagnostic needs.
Data Source
AI summary
Example methods, apparatus and articles of manufacture to diagnose temperature-induced memory errors are disclosed. A disclosed example method to diagnose a temperature-induced memory error includes detecting a memory error associated with a memory device, and writing a highest measured temperature of the memory device in the memory device when the memory error is detected, the highest temperature measured temporally near the detected memory error.