Semiconductor Memory Error Detection and Temperature Reporting
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Solution Overview
Problem
Conventional semiconductor memory devices, such as DRAM, lack functionality for temperature sensing and reporting, as well as command error detection and reporting, which limits their reliability and maintenance capabilities.
Innovation Solution
Incorporating a temperature sensor and command error module into the memory device, allowing for temperature sensing and reporting, and enabling detection and reporting of invalid command sequences, with mode registers controlling the operation of these modules and outputting error indications through an output controller.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If temperature sensing and reporting functionality is added to memory devices, then reliability and maintenance efficiency are improved, but device complexity increases
Solution Approach 1:
The patent integrates temperature sensing, command error detection, and reporting capabilities into a single memory device unit. The temperature sensor module and command error detection module share the same device architecture and output interfaces, allowing multiple functions to be performed by one device rather than requiring separate components for each function.
Solution Approach 2:
The patent combines temperature sensing functionality and command error detection functionality into the memory device structure. Both modules utilize shared resources including the output controller and reporting mechanisms, merging previously separate functions into a unified device architecture.
2Reliability
If command error detection and reporting functionality is added to memory devices, then reliability and maintenance efficiency are improved, but device complexity increases
Solution Approach 1:
The command error detection module is integrated within the memory device alongside temperature sensing. Both functions utilize shared output controllers and reporting interfaces, allowing the device to perform error detection, temperature monitoring, and data operations through a unified architecture rather than requiring separate dedicated components.
Solution Approach 2:
The patent merges command error detection functionality with the existing memory device structure, combining it with temperature sensing and other memory operations. The modules share common resources including output controllers and reporting mechanisms, reducing overall system complexity compared to separate implementations.
3Adaptability or versatility
If temperature sensing capability is added to memory devices, then operational parameter adjustment and power savings are enabled, but manufacturing complexity increases
Solution Approach 1:
The temperature sensor module is integrated into the memory device to enable operational parameter adjustments based on temperature conditions. The same device structure supports both temperature monitoring and standard memory operations, allowing adaptive refresh rates and power management without requiring entirely separate manufacturing processes for sensing components.
Data Source
AI summary
Methods, apparatuses and systems are disclosed involving a memory device. In one embodiment, a memory device is disclosed that includes a command error module of the memory device operably coupled to at least one of a command signal and an address signal and configured to detect and report a parity error on the command signal, the address signal, or combinations thereof In some embodiments, a memory device may include a temperature sensor operably coupled to a mode register. The temperature sensor may be configured to sense a device temperature and report a temperature status. Furthermore, the memory device may be incorporated into a memory module, which may be included in an electronic system.