Memory Expansion Board With Bridge Transposer For Capacity Scaling
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Solution Overview
Problem
Current computer systems are limited by an 8 gigabyte system memory limitation, facing challenges in capacitance, inductive loading, and interconnect delay, which restrict memory frequencies, and require solutions for increased capacity, ease of upgrade, reduced environmental impact, and faster access speeds.
Innovation Solution
The enhanced capacity memory system includes a dual in-line memory module carrier with an integrated memory buffer, a memory expansion board coupled via a bridge transposer, and a system interface connector, allowing for twice the memory capacity while reducing power consumption by up to 40% and providing thermal relief.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory capacity is increased to exceed 8 gigabytes, then memory capacity is improved, but capacitance, inductive loading, and interconnect delay increase which limit memory frequencies
Solution Approach 1:
The memory system is divided into multiple independent memory modules (first set and second set) that can be separately controlled and operated. Each module can function independently, allowing the system to achieve higher total capacity while maintaining optimal frequency performance in each segment. The memory buffer is also segmented to handle different modules separately.
Solution Approach 2:
A memory buffer is introduced as an intermediary component between the memory modules and the system interface connector. This buffer acts as a mediator that manages data flow and timing between multiple memory modules, enabling extended capacity while maintaining signal integrity and frequency performance through buffered signal conditioning.
2Quantity of substance
If memory capacity is extended beyond 8 gigabytes, then memory capacity is improved, but power consumption increases
Solution Approach 1:
The memory system uses multiple independent memory modules that can be selectively activated. Only the required number of modules need to be powered on at any given time, allowing the system to achieve extended capacity while consuming power only for the active modules, thereby reducing overall power consumption compared to a single large memory system.
Solution Approach 2:
The memory buffer performs self-service by managing data buffering and timing control locally within the memory module carrier, reducing the need for high-power external controllers. The system interface connector also incorporates control logic that operates autonomously to manage multiple memory modules efficiently.
3Quantity of substance
If memory capacity is extended beyond 8 gigabytes, then memory capacity is improved, but thermal management becomes more difficult
Solution Approach 1:
The memory system distributes heat-generating components across multiple separate memory modules and carriers rather than concentrating them in a single large module. This segmentation allows heat to be dissipated from multiple smaller sources, improving thermal management and reducing hot spots compared to a single high-capacity memory module.
4Quantity of substance
If multiple memory modules are integrated to increase capacity, then memory capacity is improved, but device complexity increases
Solution Approach 1:
The memory buffer and system interface connector are designed as universal components that can interface with multiple different types and configurations of memory modules. The buffer performs multiple functions including data buffering, timing control, and signal conditioning, while the interface connector handles multiple memory modules through a standardized connection protocol, reducing overall system complexity despite increased capacity.
Solution Approach 2:
The memory buffer serves as an intermediary that abstracts the complexity of managing multiple memory modules from the system interface. It handles timing synchronization, data routing, and signal conditioning between multiple modules and the external interface, thereby simplifying the overall system architecture despite the increased number of memory components.
Data Source
AI summary
A method of manufacture of an enhanced capacity memory system includes: providing a dual in-line memory module carrier having a memory module and an integrated memory buffer coupled to the memory module; coupling a memory expansion board, having a supplementary memory module, to the dual in-line memory module carrier including attaching a bridge transposer; and providing a system interface connector coupled to the integrated memory buffer and the bridge transposer for controlling the memory module, the supplementary memory module, or a combination thereof.