Memory Fin Stack Cooling for Sustained Data Throughput
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing memory sub-systems face challenges in efficiently managing heat dissipation, leading to throttling and reduced data throughput due to the need for large heat sinks that violate PCB space restrictions, resulting in inefficient performance and limited component addition.
Innovation Solution
Implementing a fin stack thermally coupled to memory components via a ground layer of the PCB to dissipate heat without violating height restrictions, acting as a remote heat sink to maintain optimal operating temperatures and prevent throughput throttling.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If large heat sinks are used to manage heat dissipation, then heat dissipation capability is improved, but PCB space restrictions are violated and device complexity increases
Solution Approach 1:
The patent transitions from planar heat dissipation (2D PCB surface) to three-dimensional heat dissipation by erecting fin stacks vertically from the PCB surface. This dimensional change allows significantly increased heat dissipation area without increasing PCB footprint, resolving the contradiction between heat dissipation capability and PCB space usage.
Solution Approach 2:
The fin stack structure nests multiple heat dissipation fins within a compact vertical space, with each fin layered or stacked to maximize heat dissipation surface area within the height constraints of the PCB assembly. This nesting approach enables efficient heat dissipation without requiring excessive PCB area.
2Temperature
If large heat sinks are used to manage heat dissipation, then heat dissipation capability is improved, but device complexity and manufacturing difficulty increase
Solution Approach 1:
The heat dissipation function is segmented into multiple thin fin structures rather than a single large heat sink mass. This segmentation simplifies manufacturing by allowing individual fins to be produced and assembled more easily, reducing the complexity of creating large monolithic heat sinks while maintaining effective heat dissipation surface area.
Solution Approach 2:
By moving heat dissipation from the PCB plane to the vertical dimension, the design avoids the complexity of large-area planar heat sinks. The fin stack structure utilizes vertical space that is already present in the PCB assembly, eliminating the need for complex large-area heat sink designs that would require sophisticated fabrication processes.
3Temperature
If data throughput is throttled to reduce temperature, then temperature control is improved, but productivity and data throughput decrease
Solution Approach 1:
The fin stack heat dissipation structure is implemented in advance before temperature thresholds are reached, continuously managing heat without requiring throughput throttling. This preliminary heat management action prevents temperature buildup that would otherwise force productivity reduction, allowing sustained high data throughput while maintaining temperature control.
Solution Approach 2:
The fin stack structure provides passive heat dissipation that automatically manages thermal load without requiring active control mechanisms to throttle throughput. The heat dissipation occurs self-service through the thermal conduction and convection properties of the fin stack, eliminating the need for throughput management interventions and maintaining continuous optimal productivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The fin stack effectively manages heat dissipation, prolonging the time to reach threshold temperatures, maintaining optimal data throughput and improving overall efficiency without consuming additional physical space.
Implementation Method 1
Heat associated with the at least one of the processing device or the set of memory components is dissipated at least in part through the fin stack
Implementation Method 2
the fin stack configured to dissipate heat from the processing device and the set of memory components
Data Source
AI summary
Aspects of the present disclosure configure a memory sub-system processor to use a fin stack to improve heat dissipation to improve a data transfer rate. The processor measures temperature of at least one of the processing device or the set of memory components. The processor accesses a reference temperature for controlling data transfer rate between a host and the set of memory components. The processor compares the measured temperature with the reference temperature and, based on the comparison, adjusts the data transfer rate based on comparing the measured temperature with the reference temperature.