Memory Foam Thermal Interface Material with Graphite for Heat Sink Installation
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Existing thermal interface materials fail to effectively manage heat transfer between electrical components and heat sinks, leading to excessive temperatures that can damage devices due to inefficient thermal conductivity and installation challenges.
Innovation Solution
A thermal interface material featuring a memory foam core with graphite wrapped around it, allowing for compressibility and slow rebound to ensure secure installation without damaging surfaces, and providing enhanced thermal conductivity by ensuring graphite comes into contact with both the heat source and heat sink.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional thermal interface materials are used to fill the gap between electrical component and heat sink, then thermal transfer efficiency is improved compared to air gap, but installation complexity increases and damage risk to surfaces occurs during compression
Solution Approach 1:
The patent applies parameter changes by utilizing the phase transition properties of phase change material (PCM) embedded in the foam core. The PCM transitions from solid to liquid at specific temperature thresholds during operation, enabling the material to adapt its thermal conductivity dynamically. This resolves the contradiction by maintaining high thermal transfer efficiency while the foam's compressibility allows easy installation without surface damage.
Solution Approach 2:
The patent employs composite materials by combining foam core with phase change material (PCM) and potentially graphite layers. The foam provides compressibility and gap-filling capability, while the PCM enhances thermal conductivity when activated by heat. This composite structure simultaneously achieves high thermal transfer efficiency and easy installation, resolving the technical contradiction between reliability and ease of operation.
2Reliability
If high compression force is applied to ensure thermal contact between TIM and heat sink surfaces, then thermal contact quality is improved, but damage to electrical component or heat sink surfaces occurs
Solution Approach 1:
The patent utilizes parameter changes through the foam's compressibility characteristics and phase change material activation. The foam can be compressed during installation to ensure contact, then maintains thermal pressure through its elastic recovery. The PCM activates at operating temperature to enhance thermal conductivity, achieving high thermal contact quality without requiring excessive compression force that would cause surface damage.
Solution Approach 2:
The patent applies beforehand cushioning by using the foam core as a protective layer during installation. The foam's compressible nature allows it to absorb installation forces, protecting the electrical component and heat sink surfaces from damage. Meanwhile, the foam ensures adequate thermal contact pressure is applied, resolving the contradiction between thermal contact quality and surface damage risk.
3Ease of operation
If TIM structure is designed to be highly compressible for easy installation, then installation ease is improved, but thermal conductivity decreases due to air gaps
Solution Approach 1:
The patent employs composite materials by integrating phase change material (PCM) within the foam core structure. The foam provides compressibility for easy installation, while the PCM fills voids and enhances thermal conductivity when activated by heat. This composite approach simultaneously achieves installation ease and high thermal conductivity, resolving the technical contradiction.
Solution Approach 2:
The patent applies parameter changes through the PCM's phase transition behavior. During installation, the foam is compressed to fill gaps. During operation, the PCM transitions from solid to liquid at specific temperature thresholds, significantly improving thermal conductivity. This dynamic parameter change resolves the contradiction between installation ease and thermal conductivity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively manages heat transfer by allowing the graphite to establish a conductive path upon memory foam expansion, reducing thermal resistance and preventing damage during installation, thus maintaining optimal operating temperatures for electrical components.
Implementation Method 1
A thermal interface material featuring a memory foam core with graphite wrapped around it, allowing for compressibility and slow rebound
Implementation Method 2
memory foam core with graphite wrapped around it, allowing for compressibility and slow rebound
Implementation Method 3
providing enhanced thermal conductivity by ensuring graphite comes into contact with both the heat source and heat sink
Data Source
AI summary
Disclosed herein are thermal interface materials (TIMs) including memory foam cores. In an exemplary embodiment, a thermal interface material generally includes a memory foam core including a plurality of sides defining a perimeter. A heat spreader is disposed at least partially around the perimeter defined by the plurality of sides of the memory foam core.