Memory Module Heat Sink Layout for Airflow Between Adjacent Boards
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Solution Overview
Problem
Conventional heat dissipation modules for memory circuit boards are too bulky and ineffective in maintaining adequate heat dissipation when multiple sets of memories are installed side by side, leading to reduced performance and potential component failure due to increased heat generation.
Innovation Solution
A heat dissipation module designed to cover main heat sources like PMIC and RCD, with a heat sink that has grooves, trenches, or fins to reduce thickness, increase surface area, and maintain air circulation between adjacent memory devices, using thermal conductivity to enhance heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of stationary object
If a full-coverage heat dissipation module is used to cover all electronic components, then the heat dissipation area is increased, but the total thickness of the memory module increases
Solution Approach 1:
The heat dissipation module is divided into a first heat sink for covering the memory chip and a second heat sink for covering the electronic component, with each heat sink independently dissipating heat from specific heat sources. This segmentation allows targeted heat dissipation without requiring a single large thick module to cover the entire memory assembly.
Solution Approach 2:
Different regions of the memory module are equipped with heat dissipation structures according to their specific heat generation characteristics. The first heat sink addresses the memory chip area while the second heat sink addresses the electronic component area, providing localized heat dissipation quality rather than uniform coverage.
2Productivity
If multiple sets of memory are installed side by side to increase computing efficiency, then the assembly space is reduced, but air circulation between memories is insufficient
Solution Approach 1:
The heat dissipation solution extends into the vertical dimension with protrusions on the first heat sink and corresponding grooves on the second heat sink. These vertical features create channels that facilitate air circulation in the Z-direction between adjacent memory modules, compensating for the reduced lateral spacing.
3Speed
If overdriving technology is used to increase voltage and operating clock rate for higher performance, then the operating frequency is increased, but heat generation increases
Solution Approach 1:
The heat dissipation module is designed and installed before the memory module is operated at overdriven frequencies. The thermal management infrastructure is prepared in advance to handle the increased heat generation that will occur during high-performance operation, preventing thermal runaway before it occurs.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design improves heat dissipation efficiency by 30-40% compared to bare memory strips, ensuring effective cooling even in confined spaces with multiple memory installations.
Implementation Method 1
the heat sink has good thermal conductivity to absorb and dissipate heat into the air
Implementation Method 2
the heat sink has good thermal conductivity to absorb and dissipate heat into the air
Data Source
AI summary
Disclosed is a heat dissipation module for a circuit board, including: a circuit board and a heat sink, wherein the circuit board is provided with at least one chip as the main heat source. The heat sink is disposed correspondingly to the outer surface of the chip to conduct heat for dissipation. By targeting the main heat source for heat dissipation, the size of the heat dissipation module is reduced. When a plurality of circuit boards are used side by side, the raised heat sinks can also push apart the adjacent circuit boards so as to form air flow channels, maintaining the gap between the circuit boards so that air can flow through and take away heat.