Memory Module Heat Sink with Integrated Fluidic Cooling
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Solution Overview
Problem
Current memory bar cooling systems are inefficient in cooling multiple memory strips due to the required pitch between them, which is constrained by the 19-inch standard in computer cabinets, and are costly to manufacture, limiting the integration of more RAM on computing blades.
Innovation Solution
A heat sink design with a shroud, outer legs, inner tabs, and a contact surface that allows for thermal contact with both memory strips and the fluidic cooling system, reducing the pitch between memory strips and enabling efficient cooling with a single heatsink, thus allowing more memory bars on a constrained blade while minimizing manufacturing costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a fluidic cooling system with metal plates is used to cool memory modules, then cooling efficiency is improved, but the device becomes bulky and requires more space around components
Solution Approach 1:
The patent merges the heat sink and cooling system into a single integrated unit. The heat sink includes a shroud that covers multiple memory modules and a contact surface that directly contacts the fluidic cooling system, eliminating the need for separate metal plates around each component. This integration reduces the overall space required while maintaining effective cooling of multiple memory modules.
2Quantity of substance
If multiple memory modules are integrated on a computing blade, then RAM capacity is improved, but the pitch between memory modules is constrained by the 19-inch standard
Solution Approach 1:
The patent transitions from cooling memory modules individually with separate components to covering multiple memory modules with a single shroud that extends across them. This dimensional approach allows the heat sink to span across multiple modules, reducing the required pitch between them and enabling higher memory density on the computing blade.
3Temperature
If traditional cooling systems with multiple screws and copper plates are used, then cooling performance is maintained, but manufacturing cost increases
Solution Approach 1:
The patent combines multiple separate cooling components (screws, copper plates, individual heat sinks) into a single integrated heat sink assembly. This reduces the number of parts that need to be manufactured, sourced, and assembled, thereby lowering manufacturing costs while maintaining effective thermal contact with the memory modules through the shroud and contact surface.
4Quantity of substance
If the pitch between memory modules is reduced to fit more RAM on a constrained blade, then memory density is improved, but thermal management becomes more difficult
Solution Approach 1:
The heat sink is segmented into multiple tabs that can be positioned between adjacent memory modules. These tabs make thermal contact with the heat exchange surfaces of the memory modules, allowing efficient heat extraction even when modules are closely spaced. The segmented structure adapts to the reduced pitch configuration while maintaining effective thermal management.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The design effectively reduces the pitch between memory strips, enabling more memory bars on a computing blade of the same size, while ensuring efficient cooling and durability, and reduces manufacturing costs by eliminating the need for multiple screws and copper plates.
Implementation Method 1
at least two outer tabs, each outer tab being configured to be in thermal contact with at least one heat exchange surface among the two heat exchange surfaces of at least one memory module
Implementation Method 2
contact surface configured to be in thermal contact with said fluidic cooling system
Data Source
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AI summary
One aspect of the invention relates to a heat sink for a plurality of memory modules that can be connected to an electronic board, each memory module comprising two heat exchange surfaces, characterized in that it comprises at least one casing comprising: - an upper surface, - at least two outer tabs, configured to be in thermal contact with at least one heat exchange surface of at least one memory module, - at least one contact surface, in thermal contact with said fluidic cooling system of said electronic board, - a plurality of inner tabs, each inner tab being interposed between two memory modules in order to make thermal contact with at least one heat exchange surface of each of the two memory modules, - said casing is removably placed against the two heat exchange surfaces of each memory module.- said envelope is mechanically and removably attached to said card.