Memory Heat Transfer Structure for Wear-Resistant Water Cooling
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Solution Overview
Problem
Conventional heat dissipation methods in electronic apparatuses, such as water-cooling systems, are inadequate for high-capacity electronic chips, leading to wear and damage issues, making it difficult for users to replace memory units without professional assistance and causing heat resistance problems.
Innovation Solution
A memory auxiliary heat transfer structure with a main body having a heated side and a contact side, featuring a wear-resistant layer and thermo-conductive medium, is inserted between the memory unit and the water-cooling assembly to enhance wear resistance and heat transfer efficiency, allowing users to replace memory units without damaging the water-cooling system.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If water-cooling assembly is directly assembled with memory unit, then heat dissipation effect is improved, but wear resistance is reduced and damage risk increases
Solution Approach 1:
The patent introduces an auxiliary heat transfer structure as an intermediary component between the water-cooling assembly and the memory unit. This auxiliary structure includes a contact surface that interfaces with both the water-cooling assembly and the memory unit, distributing contact pressure and reducing direct wear on the memory unit's external case and the water-cooling assembly's pipeline surface.
2Ease of operation
If memory unit is frequently inserted and extracted, then user convenience is improved, but abrasion damage to water-cooling assembly increases
Solution Approach 1:
The auxiliary heat transfer structure serves as a protective buffer that is already in place before any insertion or extraction operations. It cushions the mechanical contact between the memory unit and water-cooling assembly, preventing abrasion damage from occurring during frequent user operations.
3Device complexity
If conventional heat transfer component is used, then structure simplicity is maintained, but heat transfer coefficient is insufficient for high-capacity chips
Solution Approach 1:
The auxiliary heat transfer structure employs composite material construction, combining materials with high thermal conductivity for effective heat transfer from the memory unit to the water-cooling assembly. This allows the system to handle high-capacity chips while maintaining a relatively simple overall structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The structure improves wear resistance and heat conductivity, enabling users to replace memory units multiple times without damaging the water-cooling assembly or memory chips, reducing heat resistance and enhancing convenience in electronic apparatus maintenance.
Implementation Method 1
a water-cooling means must be employed to dissipate the heat... a water-cooling radiator is used to absorb heat for heat exchange
Implementation Method 2
the outer surface of the external case (metal or ceramic material) packaging the memory chip will contact and abrade the water-cooling set
Data Source
AI summary
A memory auxiliary heat transfer structure is correspondingly assembled with at least one memory unit and a water-cooling assembly. The memory auxiliary heat transfer structure includes a main body. The main body has a first end, a second end and a middle section. The middle section has a heated side and a contact side. The heated side is disposed corresponding to at least one chip disposed on the memory unit. The contact side is attached to and assembled with the water-cooling assembly. The memory auxiliary heat transfer structure serves to reduce the friction between the memory unit and the water-cooling assembly and fill the gap so as to reduce the heat resistance.