On-Die Memory Heater Circuit for Thermal Emulation Testing
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Solution Overview
Problem
Conventional methods for testing power and thermal operating conditions of microelectronic devices are inefficient, as they require building specific heater packages for each system, which is time-consuming and costly, and do not accurately model the complex interactions within real systems.
Innovation Solution
Incorporating a heater device with a resistive element and switching circuitry into microelectronic devices, such as memory devices, to emulate operational power consumption and heat generation, allowing for the simulation of anticipated power and thermal conditions without a complete system or memory controller, using resistive elements to draw anticipated current and generate heat.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If conventional methods are used to test power and thermal operating conditions, then specific heater packages must be built for each system, but this process is time-consuming and costly
Solution Approach 1:
The patent integrates a heater device directly into the microelectronic device package, creating a universal testing solution that can be used across multiple system configurations without requiring custom heater packages to be built for each system. The heater device serves multiple functions: it can emulate various power consumption levels, generate thermal conditions, and work with different memory device configurations.
Solution Approach 2:
The heater device is merged with the microelectronic device package, combining the testing function directly into the device under test. This integration eliminates the need for separate external heater packages and reduces the number of components required, thereby reducing both time and cost.
2Measurement precision
If conventional methods are used to test power and thermal operating conditions, then specific heater packages must be built for each system, but this increases costs
Solution Approach 1:
The heater device is merged with the microelectronic device package, combining the testing function directly into the device under test. This integration eliminates the need for separate external heater packages and reduces the number of components required, thereby reducing both time and cost.
Solution Approach 2:
The heater device serves multiple functions and can be used across different system configurations, reducing the need for multiple specialized components and lowering overall manufacturing costs.
3Productivity
If conventional methods are used, then external heater packages are required, but this reduces testing accuracy by not modeling complex system interactions
Solution Approach 1:
The heater device is merged with the microelectronic device package, allowing it to model complex system interactions more accurately by being part of the actual device under test rather than an external add-on.
Solution Approach 2:
The microelectronic device package includes its own integrated heater device, allowing it to self-test and self-model thermal conditions without requiring external testing equipment, thereby improving both efficiency and accuracy.
4Measurement precision
If a complete system is required for testing, then accurate thermal conditions can be measured, but this increases time and cost
Solution Approach 1:
The heater device extracts the thermal testing function from the complete system requirement and integrates it directly into the microelectronic device package, allowing thermal conditions to be measured without needing the full system assembled.
Solution Approach 2:
The microelectronic device package includes its own integrated heater device, allowing it to self-test and self-model thermal conditions without requiring external testing equipment or complete system setup, thereby improving both efficiency and accuracy.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables accurate emulation and measurement of power and thermal conditions, allowing operators to fine-tune system parameters like fan speeds and heat sinks without a complete system, reducing costs and time, and providing more specific data for system design.
Implementation Method 1
a heater device with a resistive element and switching circuitry into microelectronic devices, such as memory devices, to emulate operational power consumption and heat generation, allowing for the simulation of anticipated power and thermal conditions
Data Source
AI summary
A memory device includes at least one die and a heater device. The heater device includes a first switch element electrically connected to a power supply connection and the at least one die, a second switch element electrically connected to the first switch element, and a resistive element electrically connected to the second switch element and a ground connection. A method includes configuring the first switching element of the heater device to electrically connect the second switching element of the heater device to a power supply connection, configuring the second switching element to electrically connect one of a first resistor or a second resistor of the resistive element to the first switching element, and applying a voltage across the first resistor or the second resistor that is electrically connected to the first switching element.