Non-Volatile Memory Heating in Cold Environments

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Solution Overview

Problem

Non-volatile memory devices experience reduced operational reliability and increased bit error rates in cold temperatures, leading to delayed system boot-ups and potential failures when accessing data stored in these devices before they reach a more reliable operating temperature.

Innovation Solution

A memory system that accelerates the self-heating process of non-volatile memory devices by using a controller with a heating element to radiate heat, ensuring that memory devices reach a higher operating temperature before data access, thereby reducing latency and improving data reliability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If memory devices are operated in cold environments, then the system can function in a wider temperature range, but operational reliability decreases and bit error rates increase

Engineering Contradiction:
Improvetemperature rangeVSAvoidoperational reliability
Core Design Contradiction:
Adaptability or versatilityVSReliability

Solution Approach 1:

The system performs a self-heating operation before normal read/write operations when cold temperature is detected. This preliminary heating action warms the memory device to an optimal operating temperature range, ensuring subsequent operations occur under reliable conditions while still allowing the system to function across a wide temperature range

Inventive Principle:
Principle #10Preliminary action

2Adaptability or versatility

If memory devices are operated in cold environments, then the system can function in cold temperatures, but bit error rates increase

Engineering Contradiction:
Improvecold temperature operationVSAvoidbit error rate
Core Design Contradiction:
Adaptability or versatilityVSLoss of information

Solution Approach 1:

Before performing data read or write operations in cold environments, the system executes a self-heating sequence that activates heating circuits to raise the memory device temperature. This preliminary warming prevents bit errors during actual data operations by ensuring the memory cells are at an appropriate temperature for reliable operation

Inventive Principle:
Principle #10Preliminary action

3Reliability

If the memory device is heated to operational temperature, then data reliability improves, but system boot-up time increases

Engineering Contradiction:
Improvedata reliabilityVSAvoidboot-up time
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The system uses periodic or pulsed heating operations rather than continuous heating. The self-heating function activates in intervals to raise the temperature to the optimal range, then stops heating once the target temperature is reached. This periodic approach minimizes heating time while ensuring data reliability is achieved

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The system dynamically adjusts heating parameters such as power level and duration based on the detected temperature. By monitoring temperature and modifying heating intensity accordingly, the system reaches the optimal operating temperature faster while preventing overheating, thus reducing boot-up time while maintaining data reliability

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution decreases the operational time in less-reliable states and eliminates delays in boot-up procedures by ensuring accurate data transmission to host systems, even in cold environments.

Implementation Method 1

A memory system accelerates the self-heating process of non-volatile memory devices by using a controller with a heating element to radiate heat

Methodology Applied
Scientific EffectThermal radiation: Thermal Radiation

Data Source

PatentUS20240170029A1Memory device heating in cold environments
Publication Date: 2024.05.23 MICRON TECHNOLOGY INC
  • US20240170029A1 patent drawing
  • US20240170029A1 patent drawing
  • US20240170029A1 patent drawing

AI summary

Methods, systems, and devices for memory device heating in cold environments are described. A memory system may use system components to accelerate the heating of a non-volatile memory device that stores boot data associated with a boot up procedure at a host system. For example, the memory system may determine that a temperature associated with the memory system fails to satisfy a threshold. Based on the temperature failing to satisfy the threshold, a controller of the memory system may perform a heating procedure that increases a heat of and emitted by the controller (e.g., a heating element coupled with the controller) to accelerate the heating of the non-volatile memory device. The memory system may read the boot data from the non-volatile memory device based on the heating procedure and transmit the boot data to the host system.