Memory System I/O Path Swap for Signal Integrity
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Solution Overview
Problem
High integration semiconductor memory devices require complex interconnections on printed circuit boards, leading to signal integrity issues and cross-talk between input terminals, especially when multiple packages are connected for higher capacity memory systems like solid state disks.
Innovation Solution
A memory system with a controller and multiple memory devices, where the controller swaps input/output signals and terminals to optimize connections, using path selection means and input/output path swap units to manage terminal swaps based on reference data and connection states, ensuring normal operation despite terminal swaps.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple packages are connected to one channel for higher capacity memory systems, then memory capacity is improved, but interconnections become complex and long causing signal integrity deterioration
Solution Approach 1:
The patent applies terminal swapping where the first and second terminals of memory devices are interconnected in an inverted manner. Specifically, the first terminal of the first memory device is connected to the second terminal of the second memory device, and the second terminal of the first memory device is connected to the first terminal of the second memory device. This inversion of connection topology reduces signal interference and improves signal integrity while maintaining high memory capacity through multi-package configuration.
2Quantity of substance
If multiple packages are mounted on PCB for high density, then memory density is improved, but interconnection length increases causing cross-talk between input terminals
Solution Approach 1:
The patent employs terminal swapping that inverts the connection pattern between memory devices. By connecting the first terminal of one memory device to the second terminal of another memory device (and vice versa), the signal paths are optimized to minimize cross-talk interference. This inverted connection approach allows multiple packages to be mounted densely on the PCB while reducing the harmful cross-talk effects through improved signal routing.
3Quantity of substance
If complex interconnections are used to connect multiple packages, then memory capacity is improved, but device complexity increases
Solution Approach 1:
The patent simplifies the interconnection complexity by implementing a systematic terminal swapping scheme. Instead of using complex routing and additional signaling infrastructure, the invention uses a regular inverted connection pattern where terminals are cross-connected between memory devices. This approach maintains high memory capacity while reducing interconnection complexity through a predictable and systematic wiring pattern that is easier to implement and manage.
Data Source
AI summary
A memory system includes a controller having first and second input/output terminals, and first and second memory devices each having first and second input/output terminals. The system includes a path selection mechanism for selectively employing one of the first and second terminals of either the controller or the first memory device for communicating a first input/output signal between the controller and the first memory device, and employing the other one of the first and second terminals for communicating a second input/output signal between the controller and the first memory device. The path selection mechanism selectively employs the first and second terminals in accordance with data indicating which of the first and second terminals of the first memory device is connected to the first terminal of the controller and which of the first and second terminals of the first memory device is connected to the second terminal of the controller.