Memory Module Adapter for High Density Hybrid Configurations
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Solution Overview
Problem
Modern computer systems face challenges in increasing memory density and computation power while maintaining a compact form factor, as they require additional resources to handle large data sets efficiently, and existing memory solutions often rely on higher power chips and standardized components that limit flexibility and thermal management.
Innovation Solution
The implementation of a high-density memory system that allows multiple memory modules to be connected via a single memory interface using a module adapter, enabling hybrid configurations, reduced thermal impact, and flexible module orientations such as vertical, horizontal, or angled arrangements, which can include onboard power sources and control logic to manage memory operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If multiple memory modules are connected via a single memory interface using a module adapter, then memory capacity and system performance increase, but device complexity increases
Solution Approach 1:
The system divides the memory subsystem into multiple independent memory modules that can be individually selected and configured. Each module operates independently but can be collectively managed through the adapter, allowing flexible capacity expansion without increasing overall system complexity.
Solution Approach 2:
The module adapter serves multiple functions: it provides a single memory interface to the motherboard, supports various memory module types and configurations, enables hybrid memory architectures, and provides thermal management. This multi-functionality consolidates complexity into a single component rather than distributing it across multiple separate components.
2Quantity of substance
If higher power computer chips and large capacity memory chips are used to increase compute power or memory size, then memory capacity increases, but use of energy increases
Solution Approach 1:
The system allows different memory modules with different power characteristics to be used in the same subsystem. Low-power modules can be used in applications where energy efficiency is critical, while high-capacity modules can be used where capacity is the primary concern. The adapter enables selective configuration based on local power requirements.
3Ease of manufacture
If standardized memory products with quantized sizes and capacities are used, then ease of manufacture increases, but adaptability decreases
Solution Approach 1:
The module adapter provides dynamic configuration capabilities, allowing the memory subsystem to be adapted to different capacity and performance requirements through selective module installation. The system can be reconfigured as needs change without requiring custom-manufactured components, maintaining ease of manufacture while achieving adaptability through flexible assembly.
4Adaptability or versatility
If multiple memory modules are connected in various orientations (vertical, horizontal, angled), then adaptability increases, but device complexity increases
Solution Approach 1:
The module adapter employs asymmetric connector designs that naturally guide memory modules into specific orientations. The physical geometry of the connectors and mounting structures provides mechanical constraints that ensure proper alignment and orientation, eliminating the need for complex control mechanisms while supporting multiple configuration options.
Data Source
AI summary
Approaches, techniques, and mechanisms are disclosed for manufacturing and operating high density memory systems. The high density memory systems can increase the amount of memory available to a computing system by allowing the connection of multiple memory modules into a single memory interface on a motherboard via a memory adapter as described herein.