Memory Module Mounting Structure to Prevent Board Warping
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Solution Overview
Problem
Existing module mounting structures suffer from poor area efficiency and potential stress on chips due to the use of a relay connector board with elastic pins, which can cause the module board to warp and impose stress on chips during fastening.
Innovation Solution
A module mounting structure with a cover that includes a board support protruding portion abutting on the module board along the chip, combined with a relay connector board and fastening member to maintain a stacked configuration, preventing warping and stress on the chips.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Area of moving object
If the relay connector board is located on the rear side of the memory chips to improve area efficiency, then area efficiency is improved, but the module board bends and warps due to elastic pins pushing up the center part
Solution Approach 1:
A support structure is introduced as an intermediary element between the relay connector board and the module board. This support structure receives the elastic pins from the relay connector board and transfers the load to the cover and substrate, preventing the module board from bending and warping while maintaining the compact rear-side arrangement of the relay connector board
Solution Approach 2:
The support function is segmented from the module board itself and assigned to a separate support structure. This segmentation allows the relay connector board to be positioned on the rear side for area efficiency while the support structure independently handles the mechanical load from elastic pins, preventing warping of the module board
2Strength
If fastening screws are used to secure the relay connector board, then fastening strength is improved, but stress is imposed on the chips due to board warping
Solution Approach 1:
The support structure acts as a mediator that intercepts and redistributes the fastening forces before they reach the module board and chips. By providing an additional load path through the cover and substrate, the support structure reduces the stress concentration on the chips while maintaining secure fastening of the relay connector board
Solution Approach 2:
The support structure provides beforehand cushioning by pre-establishing a load distribution mechanism that prevents excessive stress from reaching the chips during fastening operations. The support structure absorbs and distributes the mechanical stress before it can affect the sensitive chip components
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves improved area efficiency and prevents warping of the module board, thereby reducing stress on the chips and ensuring stable electrical connections.
Implementation Method 1
a relay connector board that is located between a rear side of a part of the module where the chip is mounted and the substrate, and brings a large number of contact portions of the module and a large number of contact portions of the substrate into contact with each other by a large number of elastic pins
Data Source
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AI summary
Provided is a module mounting structure that has good area efficiency and does not impose stress on chips. A module mounting structure includes: a cover that covers a front surface of a memory module on which a memory chip is mounted; a relay connector board that is located between a rear side of a part of the memory module where the memory chip is mounted and a substrate, and brings a large number of contact portions of the memory module and a large number of contact portions of the substrate into contact with each other by a large number of elastic pins; and a screw that fastens the cover, a module board of the memory module, the relay connector board, and the substrate in a Z direction. The cover includes a board support protruding portion that protrudes toward the substrate and abuts on the module board along the memory chip.