Memory Module Conduction Element for RDIMM Conversion
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Solution Overview
Problem
The existing methods for modifying registered dual inline memory modules (RDIMMs) into unbuffered or other types of memory modules are time-consuming and resource-intensive, leading to increased costs and waste due to the need for removing and re-arranging memory units and connection interfaces, which disrupts electrical connections.
Innovation Solution
The use of a conduction element or conductor line to electrically connect solder pads on a printed circuit board, allowing for direct electrical connection between memory units and the connection interface without requiring a new printed circuit board, thereby simplifying the conversion process and reducing resource waste.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If the register is removed from an RDIMM to convert it into a UDIMM or SODIMM, then the memory module type is successfully converted, but the electrical connection between memory units and the connection interface is lost, requiring additional operations to re-establish connectivity
Solution Approach 1:
The patent introduces a conduction element as an intermediary component that bridges the memory units and connection interface after register removal. This conduction element includes conductive structures that establish electrical pathways, allowing the memory module to be converted from RDIMM to UDIMM/SODIMM while maintaining reliable electrical connectivity without requiring complete disassembly and reassembly of memory units.
2Reliability
If memory units are removed and re-arranged to establish electrical connection after register removal, then electrical connectivity is restored, but the operation time and manufacturing complexity increase significantly
Solution Approach 1:
The patent segments the electrical connection restoration function into a separate conduction element that can be independently installed. Instead of requiring the complex operation of removing and re-arranging memory units, the conduction element is designed as a distinct component that can be mounted onto the printed circuit board to restore electrical pathways, dramatically reducing modification time and operational complexity.
3Reliability
If a new printed circuit board is provided for the converted memory module, then electrical connection is ensured, but resource waste increases due to disposal of the existing printed circuit board
Solution Approach 1:
The conduction element serves as an intermediary that enables the existing printed circuit board to be retained and reused. By installing the conduction element onto the original printed circuit board, the board maintains its utility for the converted memory module type, eliminating the need to manufacture a new printed circuit board and avoiding the waste associated with disposing of the original board.
4Ease of manufacture
If the existing printed circuit board is disposed of after register removal, then electrical connection issues are avoided, but manufacturing costs and resource waste increase
Solution Approach 1:
The conduction element acts as a mediator that resolves the electrical connection issues arising from register removal while preserving the existing printed circuit board. This approach maintains manufacturing simplicity by providing a straightforward installation process for the conduction element, while simultaneously preventing resource waste by keeping the original printed circuit board in use.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly reduces the time and resources needed for conversion, eliminates the need for new printed circuit boards, and maintains electrical connectivity, thus enhancing industrial efficiency and reducing costs.
Implementation Method 1
a conduction element is combined with the solder pad zone, such that the solder pads are electrically connected by means of the conduction element
Data Source
AI summary
An improved memory module structure includes a printed circuit board, memory units disposed on the printed circuit board, and a connection interface disposed on the printed circuit board for connection with an electronic device. The printed circuit board includes a solder pad zone having solder pads electrically connected with the memory units and the connection interface. A conduction element is combined with the solder pad zone or at least one conductor line electrically connected, in the form of bridge connection, the solder pads, in order to have the solder pads electrically connected. A memory module modification method is also provided, including removing a register from an existing dual inline memory module to expose a solder pad zone, and disposing of a conduction element or arranging a conductor line to have the memory units and the connection interface of electrically connected to thereby form an improved memory module structure.