Memory Module Conductive Fins for DRAM Heat Dissipation
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Solution Overview
Problem
Existing memory modules face challenges in maintaining the refresh performance of DRAM devices due to environmental factors like temperature and voltage, which can lead to increased charge leakage and reduced data retention.
Innovation Solution
A memory module with a thermal control network that includes a conductive layer with a linear array of planar fins extending into a cavity region, enhancing heat dissipation through improved thermal conductivity and convective heat transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional heat dissipation methods are used, then the structure remains simple, but the junction temperature cannot be maintained within threshold, leading to reduced refresh performance and data retention
Solution Approach 1:
The thermal control network is segmented into multiple functional layers: conductive layers for heat collection, insulating layers for thermal isolation, and fin structures for heat dissipation. This segmentation allows each layer to perform its specific function optimally, resolving the contradiction by organizing complexity into manageable, functional segments that collectively improve reliability
Solution Approach 2:
The substrate serves multiple functions: it provides mechanical support for the DRAM devices and simultaneously acts as a thermal management system through integrated conductive and insulating layers. This multi-functionality reduces the need for separate dedicated thermal control components, improving reliability while controlling overall device complexity
2Temperature
If high thermal conductivity materials and extended conductive planes are used, then heat dissipation is improved, but manufacturing complexity increases
Solution Approach 1:
The conductive plane is merged directly with the substrate structure, eliminating the need for separate heat sink components. The conductive layers are integrated into the substrate's layer stack, combining thermal management functionality with the existing substrate manufacturing process, thereby improving heat dissipation while minimizing additional manufacturing complexity
Solution Approach 2:
The thermal control network extends in multiple dimensions: conductive layers spread heat laterally across the substrate plane, while fin structures extend vertically to increase surface area for convection. This multi-dimensional approach maximizes heat dissipation efficiency using standard PCB layering and attachment techniques, maintaining ease of manufacture
3Productivity
If the conductive layer extends into cavity regions with fin structures, then convective heat transfer is enhanced, but the structural complexity and manufacturing difficulty increase
Solution Approach 1:
The fin structures utilize curved or angled surfaces rather than purely planar geometries, which enhances convective heat transfer by promoting turbulent flow and increasing surface area exposure to cooling air. These curved features can be fabricated using standard PCB routing and etching processes, maintaining manufacturing precision while improving heat transfer rate
Solution Approach 2:
The fin structures are designed to be self-supporting and self-aligning within the cavity regions, eliminating the need for complex assembly steps. The fins attach directly to the conductive layers and extend into the cavity space, using their own geometry to maintain structural integrity and thermal contact, thereby reducing manufacturing precision requirements
4Reliability
If insulating layers are added to isolate the conductive plane from cavity regions, then thermal management is improved, but device complexity increases
Solution Approach 1:
The insulating layers serve dual functions: they provide thermal isolation between different conductive regions to prevent unwanted heat transfer paths, and they provide mechanical support and structural definition for the fin structures. This multi-functionality justifies the added layer complexity by delivering multiple benefits simultaneously
Solution Approach 2:
Insulating layers are strategically placed only in specific cavity regions where thermal isolation is needed, rather than uniformly across the entire device. This localized approach provides necessary thermal management while minimizing the overall increase in device complexity and material usage
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The thermal control network effectively maintains the junction temperature of DRAM devices within a threshold, thereby improving refresh performance, data retention, stability, reducing power consumption, and lowering heat generation.
Implementation Method 1
a conductive layer of the vertically-arranged conductive layers receives, through thermal conduction, heat that is generated by the one or more integrated circuit devices
Implementation Method 2
the linear array of planar fins transfers the heat for dissipation to an environment surrounding the multi-layer substrate
Data Source
AI summary
Implementations described herein relate to various semiconductor device assemblies. In some implementations, a semiconductor device assembly includes a multi-layer substrate populated with one or more integrated circuit devices that includes one or more core layers interspersed with one or more vertically-arranged conductive layers. A conductive layer of the vertically-arranged conductive layers includes a linear array of planar fins that extends into a cavity region along an edge of the multi-layer substrate. The linear array of planar fins is configured to receive, through the conductive layer, heat that is generated by the one or more integrated circuit devices, and transfer the heat for dissipation to an environment surrounding the semiconductor device assembly.