Memory Module Cooling via Dual-Layer Thermal Interface
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Solution Overview
Problem
Computers with memory modules face excessive heat generation, which can adversely affect the modules and other components, especially with increasing power consumption levels exceeding 12 W per module, making air-based cooling insufficient in many systems, including those with no air flow.
Innovation Solution
The implementation of thermal interface devices that thermally couple memory modules to heat sinks or liquid-cooled cold plates, utilizing a combination of resilient and malleable thermally conductive materials to create a robust and conformable interface, eliminating the need for traditional thermal interface materials and ensuring effective heat dissipation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If air-based cooling is used for memory modules, then the cooling system is simple and easy to implement, but it becomes insufficient when power consumption exceeds 12 W per module or when there is no air flow in the system
Solution Approach 1:
The patent applies liquid cooling instead of air cooling by implementing a thermal interface device that couples memory modules to a liquid-cooled cold plate. The cold plate circulates coolant to remove heat from high-power memory modules (exceeding 12W), providing effective cooling where air-based systems fail due to insufficient heat dissipation capacity.
2Reliability
If traditional thermal interface materials are used, then the interface is simple to manufacture, but it lacks robustness and conformability to varying module dimensions
Solution Approach 1:
The thermal interface device uses a composite structure combining resilient material (for conformability to varying module dimensions) and malleable thermally conductive material (for reliable thermal coupling). This composite approach eliminates traditional thermal interface materials while providing both robustness and adaptability to different memory module sizes and shapes.
Solution Approach 2:
The patent changes the physical parameters of the thermal interface by using materials with specific resilient and malleable properties. The resilient outer layer deforms elastically to conform to surface irregularities, while the malleable inner layer flows to ensure complete thermal contact, creating a reliable interface without traditional thermal compounds.
3Reliability
If resilient and malleable thermally conductive materials are combined in a dual-layered interface device, then thermal contact robustness and conformability are improved, but the device complexity increases
Solution Approach 1:
The thermal interface device is segmented into two functional layers: an outer resilient layer for mechanical conformability and an inner malleable thermally conductive layer for optimal thermal contact. This segmentation allows each layer to perform its specific function efficiently, creating a robust thermal interface that adapts to varying module dimensions while maintaining reliable thermal coupling.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution provides superior cooling for memory modules, maintaining thermal contact even in systems with no air flow, reducing the risk of damage and improving reliability by using a dual-layered interface device with resilient outer and malleable inner layers, effectively managing heat dissipation across varying module dimensions.
Implementation Method 1
thermal interface devices that thermally couple memory modules to heat sinks or liquid-cooled cold plates
Implementation Method 2
resilient outer and malleable inner layers
Implementation Method 3
malleable inner layers
Implementation Method 4
liquid-cooled cold plates
Data Source
AI summary
An example thermal interface device to attach to and cool a memory module. The device includes two sides sections that cover and contact the side faces of the memory module when installed. The device includes an outer layer that is a thermally conductive and resilient material, and an inner layer that is a thermally conductive and malleable metal. The inner layer may be nested within the outer layer, and the inner layer contacts the memory circuits of the memory module when installed. The outer layer includes spring fingers extending outward so as to contact and be compressed by a heat transfer device, such as a heat pipe, that is positioned on a side of the memory module. A thermally conductive path is thereby provided between the memory module and the heat transfer device via the thermal interface device.