Semiconductor Memory Module Corner Fixing for Solder Ball Reliability
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Solution Overview
Problem
Semiconductor memory modules face reliability issues due to the elastic restoring force of flexible connectors causing physical stress on solder balls, leading to cracks and reduced storage density.
Innovation Solution
The use of fixing structures with specific slots for corner fitting suppresses the elastic restoring force of flexible connectors, dispersing physical stress and improving module reliability, while maintaining efficient space utilization by avoiding package areas for corner insertion.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If flexible connectors are used to connect substrates, then electrical connectivity is achieved, but elastic restoring force causes physical stress on solder balls leading to cracks
Solution Approach 1:
The harmful elastic restoring force is extracted and isolated from the solder ball region by introducing a fixing structure that engages with corner fittings. This separates the flexible connector's electrical function from its mechanical stress generation, preventing stress transmission to the solder balls while maintaining electrical connectivity.
Solution Approach 2:
The fixing structure with corner fittings acts as an intermediary element between the flexible connector and the substrates. It absorbs and dissipates the elastic restoring force through the corner fitting engagement, serving as a mediator that protects the solder balls from direct mechanical stress while allowing the flexible connector to maintain electrical connections.
2Reliability
If fixing structures with corner fittings are implemented, then physical stress is suppressed and reliability is improved, but device complexity increases
Solution Approach 1:
The fixing structure is segmented into distinct functional elements: corner fittings that engage with substrate corners and a body portion that interfaces with the flexible connector. This segmentation allows each component to be optimized independently and simplifies the overall assembly process, reducing manufacturing complexity while maintaining reliability benefits.
3Area of stationary object
If corner areas are used for fixing structures, then space utilization is efficient, but flexibility in design is reduced
Solution Approach 1:
The corner fittings serve multiple functions: they provide mechanical anchoring for the fixing structure, engage with substrate corners for precise positioning, and act as stress distribution points. This multi-functionality maximizes the utility of the corner regions without constraining other design parameters, maintaining both space efficiency and design flexibility.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the reliability of semiconductor memory modules by reducing solder ball cracks and maintaining efficient space utilization, thereby improving overall module performance.
Implementation Method 1
the elastic restoring force of flexible connectors causing physical stress on solder balls
Data Source
AI summary
A semiconductor memory module is disclosed. The semiconductor memory module includes a first substrate including a first corner, first semiconductor packages mounted on a lower surface of the first substrate, a second substrate disposed over the first substrate and including a second corner corresponding to the first corner, second semiconductor packages mounted on an upper surface of the second substrate, and a fixing structure in which the first corner and the second corner are fitted.