Server Memory Module Layout for Low-Cost Hot-Cold Data Migration
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Solution Overview
Problem
Conventional server systems face limitations in memory performance and capacity due to the limited number of dual inline memory modules that can be encapsulated with a processor, and existing solutions for expanding memory involve high labor and development costs.
Innovation Solution
A memory module with a processing module and gold finger connector that allows communication with external components, using a second integrated unit to transmit access frequency information for data migration, reducing the need for re-developing the ASIC and minimizing additional costs.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory modules are placed outside the server mainboard to expand memory capacity, then memory capacity is improved, but access delay increases
Solution Approach 1:
The patent introduces an ASIC (application-specific integrated circuit) as an intermediary component between the processor and external memory modules. The ASIC manages data migration between mainboard memory and external memory, optimizing access patterns to reduce the impact of increased access delay while expanding total memory capacity.
Solution Approach 2:
The system performs preliminary data migration by identifying frequently accessed data (hot data) and proactively moving it from external memory modules to mainboard memory before it is needed. This anticipatory action reduces the impact of access delay by ensuring hot data resides in faster memory.
2Loss of time
If ASIC is used to migrate frequently accessed data to reduce access delay, then access delay is improved, but development cost and labor cost increase
Solution Approach 1:
The ASIC is designed with multi-functionality, handling both memory management tasks (data migration, access optimization) and serving as a general-purpose interface controller. This universal design reduces development costs by reusing the same hardware block for multiple functions rather than requiring specialized circuits for each task.
Solution Approach 2:
The ASIC implements self-service mechanisms by autonomously monitoring memory access patterns and automatically migrating data without requiring complex external control logic. This self-managing capability reduces the need for additional control circuits and simplifies the overall system architecture, lowering development costs.
3Productivity
If more memory modules are encapsulated with the processor, then memory performance is improved, but the number of memory modules is limited by rack size
Solution Approach 1:
The patent transitions from a two-dimensional layout (memory modules on the mainboard plane) to a three-dimensional architecture by adding external memory modules connected via PCIe or other interfaces. This dimensional change allows memory capacity to scale beyond the physical constraints of the mainboard area while maintaining rack compatibility.
Solution Approach 2:
The memory system is segmented into two independent parts: mainboard-embedded memory modules for high-performance access and external memory modules for capacity expansion. This segmentation allows each part to be optimized independently - the mainboard memory for speed and the external memory for capacity - while working together as a unified memory system.
Data Source
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AI summary
A memory module, an electronic device, and a data migration method are provided, to implement a low-cost memory expansion solution of a server system. A solution in which cold and hot migration is jointly implemented by using a processing module in the memory module and a component outside the module can reduce working pressure of the processing module, and has a simpler research and development process and needs lower labor costs and research and development costs than a solution in which an integrated unit in a memory module is re-developed to independently implement cold and hot migration, to help implement the low-cost memory expansion solution of the server system. In addition, a power pin of a gold finger connector in the memory module is redefined as a pin whose width is greater than that of an original power pin, so that a through-current capability of the power pin can be improved, supply power of the power pin can be increased, and increased supply power can support arrangement of more storage media in the memory module, to further expand a memory of the server system.