Server Memory Module Data Migration for Low-Cost Capacity Expansion
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Solution Overview
Problem
Conventional server systems face limitations in memory performance and capacity due to the restricted number of memory modules that can be encapsulated with a processor, leading to increased access delays and high development costs when expanding memory through existing solutions.
Innovation Solution
A memory module with a processing module and gold finger connector is used to facilitate communication with external components, allowing for low-cost memory expansion by adding a second integrated unit for data migration without re-developing the existing ASIC, utilizing an out-of-band communication bus for access frequency information transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Quantity of substance
If memory modules are placed outside the server mainboard to expand memory capacity, then memory capacity is improved, but access delay increases
Solution Approach 1:
An ASIC (Application-Specific Integrated Circuit) is introduced as an intermediary component between the CPU and external memory modules. The ASIC manages data migration between internal and external memory, reducing access delay by pre-fetching and caching frequently accessed data closer to the CPU while maintaining expanded memory capacity through external modules.
Solution Approach 2:
The memory system is segmented into internal memory (on mainboard) and external memory (off mainboard), with different access priorities. Frequently accessed data is stored in internal memory while less frequently accessed data resides in external memory, optimizing the balance between capacity and access speed.
2Loss of time
If ASIC is re-developed to migrate frequently accessed data to server mainboard, then access delay is reduced, but development cost increases
Solution Approach 1:
The ASIC is designed with multi-functional capabilities that leverage existing CPU instructions and system resources. It performs data migration, caching, and memory management functions using general-purpose hardware resources, reducing the need for custom-designed specialized circuits and lowering development costs.
Solution Approach 2:
The system uses existing CPU capabilities and system memory to assist the ASIC in data migration operations. The CPU can directly participate in data transfer operations, reducing the burden on the ASIC and eliminating the need for expensive dedicated high-speed transfer hardware.
3Productivity
If more memory modules are encapsulated with processor in conventional server, then memory performance is improved, but rack size limitation is exceeded
Solution Approach 1:
Instead of increasing memory density in the horizontal plane (which would exceed rack width limits), the solution extends memory capacity into the vertical dimension by placing memory modules outside the mainboard in available rack space. This allows memory expansion without violating the 430mm width constraint.
Solution Approach 2:
The external memory modules are integrated into the server system architecture as nested components, managed by the ASIC and CPU through standardized interfaces. This nested arrangement allows the system to access external memory resources while maintaining the compact mainboard design within rack specifications.
Data Source
AI summary
A low-cost memory expansion solution of a server system utilizes cold and hot migration using a processing module in a memory module and a component outside the module to reduce working pressure of the processing module. A power pin of a gold finger connector in the memory module is redefined as a pin whose width is greater than that of an original power pin so that a through-current capability of the power pin can be improved, supply power of the power pin can be increased, and increased supply power can support arrangement of more storage media in the memory module, to further expand a memory of the server system.