Memory Module Ground Shield via Plate Conductor
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Solution Overview
Problem
Small and thin mold type semiconductor memory devices pose a challenge in directly connecting a metal shield to the ground terminal, as the substrate is entirely sealed with resin, preventing effective electromagnetic interference (EMI) reduction and heat dissipation.
Innovation Solution
A memory module design that includes a substrate with a ground terminal, a semiconductor memory device, a plate-form conductive member, and wires connecting the ground terminal to the conductive member, which functions as a ground shield to reduce EMI and serves as a heat radiator, using adhesives like thermosetting resin for sealing and protection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If a metal shield is provided outside the mold, then electromagnetic interference is reduced, but it is impossible to directly connect the metal shield to the ground terminal on the substrate
Solution Approach 1:
The patent introduces a conductive member as an intermediary element that bridges the sealed mold package and the ground terminal on the substrate. This conductive member penetrates through the mold resin to establish electrical connection, serving as a mediator that resolves the contradiction between providing EMI shielding and maintaining manufacturability with sealed packages
Solution Approach 2:
The conductive member is nested within the mold resin structure, with part of it extending through the sealed package to connect with the ground terminal. This nesting approach allows the shield to be integrated within the package structure while maintaining connection to the external ground, solving the manufacturing connection issue
2Reliability
If the substrate is entirely sealed with resin, then the semiconductor device is protected, but direct connection to ground terminal for heat dissipation and EMI reduction is prevented
Solution Approach 1:
The patent applies local quality by creating a specific pathway through the mold resin only where needed for thermal and electrical connection. The conductive member penetrates locally through the sealed package to establish heat dissipation and ground connection, while the rest of the package remains fully sealed for protection
Solution Approach 2:
The solution segments the sealed package structure by introducing a conductive pathway that divides the resin seal into regions - one that remains intact for protection and another that allows thermal/electrical connection to the ground terminal, resolving the contradiction between sealing and heat dissipation
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Effectively reduces electromagnetic interference and facilitates heat dissipation for the semiconductor memory device by establishing a stable ground potential connection, even in sealed mold type packages, enhancing operational stability and performance.
Implementation Method 1
The wire electrically connects the ground terminal to the plate-form conductive member
Implementation Method 2
the plate-form conductive member is provided on the semiconductor memory device... functions as a ground shield to reduce EMI
Implementation Method 3
The mold member is used for sealing the semiconductor memory device on the substrate, the plate-form conductive member and the wire
Implementation Method 4
using adhesives like thermosetting resin for sealing and protection
Data Source
AI summary
According to one embodiment, a memory module includes a substrate, a semiconductor memory device, a plate-form conductive member, wire, and a mold member. The substrate includes a ground terminal to which a ground potential is applied. The semiconductor memory device is provided on the substrate. The plate-form conductive member is provided on the semiconductor memory device. The wire that electrically connects the ground terminal to the plate-form conductive member. The mold member seals the semiconductor memory device on the substrate, the plate-form conductive member and the wire.