Memory Module Heat Sink Clamping Mechanism
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Solution Overview
Problem
Conventional heat sink and memory module arrangements face issues with secure attachment, as hooks can be displaced and require damage to U-shaped locating grooves for detachment, leading to inefficiencies in heat dissipation and module performance.
Innovation Solution
The proposed solution involves two heat sinks with flat bases, bonding surfaces, mounting units with locating plugs and grooves, and retaining spring strips, along with clamps that securely engage the heat sinks and memory module, allowing for easy detachment without damaging the grooves and enhancing heat dissipation with a heat transfer compound.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If hooks are used to fasten heat sinks together, then the heat sinks can be secured to the memory module, but the hooks may be forced away from the hook holes by external force causing displacement
Solution Approach 1:
The patent uses elastic deformation of the hooks to create a dynamic locking mechanism. The hooks are designed to elastically deform during installation to engage with the memory module and heat sinks, and this elastic property prevents them from being forced away by external forces, thereby resolving the contradiction between attachment strength and reliability.
2Strength
If U-shaped locating grooves are used to secure clamps, then the clamps can be attached to heat sinks, but a pry tool must be used to damage the grooves for detachment
Solution Approach 1:
The patent divides the clamp structure into separable components: the clamp body and the locating grooves are designed as independent elements. The locating grooves are integrated into the heat sink rather than the clamp, allowing the clamp to be removed without damaging the heat sink structure, thus resolving the contradiction between attachment strength and ease of detachment.
Solution Approach 2:
The patent introduces an intermediary mechanism where the locating grooves serve as a mediator between the clamp and the heat sink. These grooves provide a dedicated interface for clamp attachment that can be engaged and disengaged without damage, eliminating the need for pry tools and resolving the contradiction between secure attachment and easy detachment.
3Temperature
If heat transfer bonding pads are used to bond heat sinks to the memory module, then heat dissipation is enabled, but the overall thermal efficiency may be reduced compared to direct bonding
Solution Approach 1:
The patent extracts the heat transfer bonding pads from the thermal conduction path and relocates them to the mounting surfaces of the heat sinks. This separation removes the thermal resistance introduced by bonding pads in the heat flow path, allowing for more efficient heat transfer from the memory module to the heat sinks while still providing the necessary mechanical bonding function.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This arrangement provides a secure, efficient, and damage-free method for attaching and detaching heat sinks from the memory module, ensuring reliable heat dissipation and preventing damage to the module during clamping, while improving thermal efficiency with the applied heat transfer compound.
Implementation Method 1
two heat transfer bonding pads C are respectively sandwiched between the two opposite sides of the memory module D and the two heat sinks A
Implementation Method 2
a plurality of retaining spring strips respectively extended from the flat base for securing the clamps
Data Source
AI summary
A memory module and heat sink arrangement is disclosed to include a memory module, two heat sinks attached to two opposite sides of a memory chip of the memory module, each heat sink having a mounting unit at a top side and multiple retaining spring strips suspending below the mounting unit, and multiple clamps respectively clamped on the two heat sinks and engaged with the retaining spring strips of the two heat sinks and respectively stopped between guide blocks at the two heat sinks to hold respective locating plugs of one of the two heat sinks in engagement with respective locating grooves of the other of the two heat sinks.