Memory Module Heat Sink with Integrated Fan Mounting
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional heat-dissipating mechanisms for memory modules are inefficient in transferring heat due to gaps and occupy valuable space on the motherboard, leading to potential damage and reduced operating efficiency.
Innovation Solution
A heat-dissipating mechanism comprising first and second heat-dissipating devices connected via protrusions and positioning rails, enhancing direct contact and heat transfer while optimizing space utilization by integrating a fan module for forced convection.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a supporting frame is used to mount the fan, then the fan can be positioned for cooling, but the supporting frame creates a gap from the metallic plate reducing heat-dissipating efficacy and occupies much space on the motherboard
Solution Approach 1:
The patent merges the fan mounting function directly into the metallic plate structure by providing a through-hole in the metallic plate for receiving the fan. This eliminates the need for a separate supporting frame, removes the gap between the frame and metallic plate, and maximizes motherboard space utilization while maintaining effective heat dissipation.
2Temperature
If thermal pads are used to attach metallic plates to the memory module, then heat transfer is enhanced through direct contact, but the structure requires additional components and assembly steps
Solution Approach 1:
The patent uses thermal pads as an intermediate material between the memory module and metallic plates, creating a composite structure that combines the thermal conductivity of metal with the adhesive and thermal transfer properties of the thermal pad material. This ensures effective heat transfer while simplifying the overall attachment mechanism.
3Reliability
If conventional heat-dissipating devices are attached to the memory module, then heat can be transferred to the surrounding, but the elevated operating temperature may still result in damage or reduced operating efficiency
Solution Approach 1:
The patent ensures continuous heat dissipation through direct thermal contact between the memory module, thermal pads, and metallic plates, with the fan continuously forcing air flow through the heat-dissipating structure. This continuous heat removal action maintains lower operating temperatures and enhances reliability.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The mechanism effectively dissipates heat generated by memory modules, improving operating stability and increasing motherboard space utilization through enhanced heat transfer and efficient cooling.
Implementation Method 1
the thermal pads 101 at the inner surfaces of the metallic plates 10 are in direct contact with the memory module 11, the heat-dissipating efficacy is enhanced
Implementation Method 2
a fan may be used for further removing the heat generated by the memory module
Data Source
AI summary
A heat-dissipating mechanism includes a first heat-dissipating device, a first positioning device, a second heat-dissipating device and a second positioning device. The first heat-dissipating device is contacted with a memory module. The first positioning device is disposed on the first heat-dissipating device and includes a protrusion. The second heat-dissipating device is connected with the first heat-dissipating device. The second positioning device has a positioning rail formed in the second heat-dissipating device and corresponding to the protrusion. The second heat-dissipating device is connected with the first heat-dissipating device when the protrusion of the first positioning device is embedded into the positioning rail second positioning device.