Thermally Enhanced Memory Module Heat Dissipation
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Solution Overview
Problem
Existing heat spreader solutions for semiconductor memory devices primarily improve thermal performance by enhancing the top surface heat dissipation, neglecting the critical thermal paths through the package leadframe/substrate, which limits overall thermal efficiency.
Innovation Solution
The implementation of a heat spreader mounted directly onto the internal electrical layers of the PCB substrate, utilizing vias for both electrical and thermal connections, and the use of substrate heat spreaders that extend above the PCB edge to improve thermal conductivity and airflow, thereby enhancing heat dissipation from both the top and bottom surfaces.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a heat spreader is mounted on the top surface of the device, then heat dissipation from the top surface is improved, but thermal paths through the package leadframe/substrate are not improved
Solution Approach 1:
The heat spreader is divided into two separate components: a top surface heat spreader mounted on the device top surface, and a substrate heat spreader mounted on the bottom surface of the package substrate. This segmentation allows independent optimization of thermal paths through both the top surface and the package leadframe/substrate, resolving the contradiction by addressing each thermal path separately rather than attempting to improve both with a single component.
2Reliability
If the package leadframe/substrate thermal path is improved, then overall thermal performance is significantly improved, but existing heat spreader solutions do not address this path
Solution Approach 1:
The substrate heat spreader serves multiple functions simultaneously: it acts as a thermal conductor to improve heat dissipation from the package substrate, provides a mounting surface for additional thermal management components, and extends beyond the substrate edges to create airflow channels. This multi-functionality achieves comprehensive thermal path improvement without proportionally increasing device complexity.
Solution Approach 2:
The substrate heat spreader extends in the lateral dimension beyond the edges of the package substrate, creating a three-dimensional thermal management structure. This extension into the lateral dimension allows the heat spreader to intercept heat flow from multiple directions and create effective airflow paths, thereby improving overall thermal performance while maintaining a compact form factor.
3Temperature
If heat spreader surface area is increased to improve air cooling, then heat dissipation effectiveness is improved, but thermal paths through the package are not addressed
Solution Approach 1:
The thermal management system is segmented into two independent heat spreader components positioned at different locations: one on the top surface and one on the bottom surface. Each component independently improves heat dissipation through its respective surface, while collectively they address both major thermal paths (top surface and package substrate) without requiring a single oversized heat spreader that would not effectively address internal package thermal paths.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach significantly improves the thermal performance of memory modules by effectively dissipating heat through the package leadframe/substrate, reducing operating temperatures and enhancing reliability and performance.
Implementation Method 1
The heat spreader provides a conductive path to a larger radiating surface area. The larger radiating surface area makes air cooling more effective since there is a larger surface area for the heat to dissipate from into the air.
Implementation Method 2
The heat spreader provides a conductive path to a larger radiating surface area. The larger radiating surface area makes air cooling more effective since there is a larger surface area for the heat to dissipate from into the air.
Implementation Method 3
utilizing vias for both electrical and thermal connections
Data Source
AI summary
A thermally enhanced memory module is claimed. The memory module includes a first extended electrical plane, and a thermal connection between a surface plane of its substrate and the first extended electrical plane. A first thermal management, such as a heat spreader, is coupled to the surface plane of the substrate and to the thermal connection.