Memory Module Heatpipe Cooling with Secondary Spreader
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Solution Overview
Problem
High-power density electronics, such as memory modules, face thermal management challenges due to increased power consumption and limited space for heat dissipation, leading to reduced performance and potential error rates, as conventional passive cooling methods are insufficient for efficient heat removal.
Innovation Solution
A cooling apparatus utilizing a heatpipe embedded in a primary heat spreader on the memory module, with a secondary heat spreader positioned above to create an air gap and increase surface area for enhanced heat dissipation, employing a coolant with a boiling point below the maximum operating temperature to facilitate efficient phase change-based heat absorption and release.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Loss of energy
If conventional passive heat spreaders are used, then the device structure is simple, but the heat dissipation efficiency is insufficient for high-power density memory modules
Solution Approach 1:
The patent employs a heatpipe containing a working fluid that undergoes phase transitions (evaporation at the evaporator section contacting memory chips, condensation at the condenser section) to efficiently transfer heat away from high-power density memory modules, resolving the contradiction between heat dissipation efficiency and device complexity
Solution Approach 2:
The heatpipe acts as an intermediary thermal management component between the memory chips and the environment, using a working fluid as mediator to transfer heat through phase change, thereby improving heat dissipation efficiency without requiring complex active cooling systems
2Power
If the memory module operates at higher power consumption levels, then the performance is improved, but the junction temperature increases reducing reliability
Solution Approach 1:
The heatpipe utilizes phase transitions of the working fluid (evaporation and condensation) to actively remove heat from the evaporator section, maintaining stable junction temperatures even when memory modules operate at higher power consumption levels, thus preserving reliability
3Loss of energy
If the radiator surface area is increased, then the heat dissipation capability is improved, but the available space on the motherboard is reduced
Solution Approach 1:
The heatpipe leverages phase transitions to achieve high heat dissipation capability in a compact form factor, concentrating the heat transfer function in the evaporator and condenser sections without requiring a large radiator surface area, thus resolving the space constraint contradiction
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution effectively transfers heat from memory chips to the heatpipe, promoting efficient heat transfer to the environment through the secondary heat spreader, thereby reducing junction temperatures and maintaining high performance by actively managing thermal loads.
Implementation Method 1
employing a coolant with a boiling point below the maximum operating temperature to facilitate efficient phase change-based heat absorption and release
Implementation Method 2
the coolant within the heatpipe evaporates if the targeted maximum operating temperature is reached
Implementation Method 3
A cooling apparatus utilizing a heatpipe embedded in a primary heat spreader on the memory module
Implementation Method 4
The secondary heat spreader is exposed to forced or natural convection airflow conditions, which causes heat to be dissipated from the remote end of the heatpipe into the surrounding environment
Implementation Method 5
heat to be dissipated from the remote end of the heatpipe into the surrounding environment
Data Source
AI summary
A method and apparatus for cooling chips on a computer memory module. The apparatus includes a primary and secondary heat spreaders, at least a first heatpipe coupled to the primary heat spreader and having a remote portion spaced apart from the primary heat spreader and thermally contacting the secondary heat spreader, and a coolant within the first heatpipe and the primary heat spreader so as to absorb heat from the primary heat spreader and conduct the heat to the secondary heat spreader. The primary heat spreader has at least two panels configured to engage the memory module therebetween, with facing contact surfaces of the panels adapted for thermal contact with the module chips. The secondary heat spreader is configured to increase surface dissipation of heat from the first heatpipe into the environment. The coolant has a boiling point at or below a maximum preselected operating temperature of the module chips.