Crashworthy Memory Module Insulator Crack Sealing

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Solution Overview

Problem

Existing crashworthy memory modules for locomotives are inadequate in preventing heat transfer through cracks in the insulation during high-temperature accidents, as they require an applied voltage for thermal control and do not effectively seal cracks to protect electronic components from external heat.

Innovation Solution

A memory module with an insulator that expands and flows into cracks when subjected to a threshold temperature, using a filler material with high thermal conductivity to seal gaps and prevent heat penetration.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If an active thermoelectric controller is used to control hard drive temperature, then the hard drive temperature can be maintained within an operable range, but the system becomes inadequate when voltage supply fails during an accident

Engineering Contradiction:
Improvehard drive temperatureVSAvoidthermal control reliability
Core Design Contradiction:
TemperatureVSReliability

Solution Approach 1:

The phase change material automatically absorbs excess heat from the hard drive when temperature rises, without requiring external power supply or control systems. The material self-regulates temperature through its inherent phase change properties, eliminating dependency on active voltage-controlled systems that may fail during accidents.

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The patent utilizes the phase transition properties of phase change materials (PCM) that absorb heat during melting and release heat during solidification. This phase transition mechanism provides passive thermal regulation, maintaining hard drive temperature within operational limits without requiring active control systems or external power during accidents.

Inventive Principle:
Principle #36Phase transitions

2Object-affected harmful factors

If heavy insulation is used around the memory module, then heat protection is improved, but heat can still penetrate through cracks in the insulation during high-temperature accidents

Engineering Contradiction:
Improveheat protectionVSAvoidcrack sealing effectiveness
Core Design Contradiction:
Object-affected harmful factorsVSReliability

Solution Approach 1:

The sealant material's physical properties change in response to temperature variations. When temperature increases during an accident, the sealant softens and becomes more fluid, allowing it to flow into and seal cracks in the insulation. This parameter change enables the sealant to dynamically adapt to thermal conditions and maintain sealing effectiveness.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The sealant is pre-applied to potential crack locations and interfaces in the insulation structure before an accident occurs. This beforehand cushioning ensures that when cracks do form during high-temperature events, the sealant is already in position to prevent heat penetration, providing proactive rather than reactive protection.

Inventive Principle:
Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The solution effectively seals cracks in the insulator, preventing heat damage to electronic components by expanding and filling gaps at elevated temperatures, thus safeguarding data storage during accidents involving high temperatures and fires.

Implementation Method 1

an insulator configured to expand and flow into one or more cracks in the insulator, when the insulator is subjected to a threshold temperature

Methodology Applied
Scientific EffectThermal expansion: Thermal Expansion

Data Source

PatentUS9263358B2Crashworthy memory module having a crack repair system
Publication Date: 2016.02.16 PROGRESS RAIL SERVICES CORP
  • US9263358B2 patent drawing
  • US9263358B2 patent drawing
  • US9263358B2 patent drawing

AI summary

A memory module is disclosed. The memory module may have an insulator. The memory module may also have a device disposed within the insulator. The memory module may further have a filler disposed on the device. The filler may be configured to expand and flow into one or more cracks in the insulator, when the filler is subjected to a threshold temperature.