Memory Module Management Device Power Sequencing

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Solution Overview

Problem

The existing DRAM module management systems face challenges with power management due to the 'chicken and egg' issue where the PMIC must always be on to power the SPD hub, leading to power wastage and potential errors affecting access to the PMIC, especially in power-sensitive applications.

Innovation Solution

A memory module management device that consolidates SPD, Hub, and PMIC into a single monolithic component, enabling flexible internal bussing and adding new functions for integration and security, with a microcontroller for programmable sequences and authentication, allowing for dynamic bus switching and improved power management.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of operation

If the PMIC is always on to power the SPD hub, then the host can manage the PMIC, but power is wasted continuously

Engineering Contradiction:
Improvemanageability of PMICVSAvoidpower consumption
Core Design Contradiction:
Ease of operationVSLoss of energy

Solution Approach 1:

The PMIC is powered up in advance during the memory module initialization sequence before the host needs to manage it. The initialization sequence ensures PMIC is activated only when needed, avoiding continuous power consumption while maintaining manageability.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

Instead of continuous operation, the PMIC is activated periodically only during initialization and management operations. The system transitions the PMIC to a low-power state when not actively needed, reducing energy loss while preserving operational capability.

Inventive Principle:
Principle #19Periodic action

2Ease of operation

If the PMIC powers the SPD hub, then the host can access the PMIC, but errors in SPD/hub prevent reaching the PMIC

Engineering Contradiction:
Improveaccess to PMICVSAvoidaccess reliability
Core Design Contradiction:
Ease of operationVSReliability

Solution Approach 1:

The management functions are segmented into separate components with independent power and control paths. The authentication component and PMIC can be accessed independently of the SPD hub, so errors in one component do not prevent access to others.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

An authentication component serves as an intermediary that provides alternative access paths to the PMIC. If the SPD hub fails, the host can still reach the PMIC through the authentication component, ensuring reliable access.

Inventive Principle:
Principle #24Intermediary (Mediator)

3Adaptability or versatility

If multiple discrete components are used on the DRAM module, then extended functionality is supported, but manageability and sequencing requirements increase

Engineering Contradiction:
Improveextended functionalityVSAvoidmanageability complexity
Core Design Contradiction:
Adaptability or versatilityVSDevice complexity

Solution Approach 1:

Multiple discrete components (SPD, authentication, PMIC) are merged into a single integrated memory module management device. This consolidation maintains all extended functionalities while simplifying the management architecture and reducing sequencing complexity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The integrated management device performs multiple functions universally - it can handle authentication, power management, and SPD operations within a single component. This multi-functionality eliminates the need for complex inter-component sequencing while preserving all extended capabilities.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Data Source

PatentUS20230103368A1Memory module management device
Publication Date: 2023.04.06 INTEL CORP
  • US20230103368A1 patent drawing
  • US20230103368A1 patent drawing
  • US20230103368A1 patent drawing

AI summary

A memory module management device and associated apparatus and methods. The device integrates multiple blocks and components on a substrate, including a host input/output (I/O) interface coupled to a host-side port, a power management component, and a device-side I/O interface and router coupled to a plurality of device-side I/O ports. The device is configured to be mounted on a memory module having a plurality of Dynamic Random Access Memory (DRAM) devices that are coupled to the device-side I/O ports and execute firmware instructions on a processing element to facilitate communication between a host in which the memory module is installed and the plurality of DRAM devices using sideband communication. Sideband communication between the host and data buffers and thermal sensors on the memory module are also supported. The device also may be configured to provide scratchpad memory and/or a mailbox. Authentication of the firmware instructions is also supported.