Memory Module Pad Layout for Multi-Socket Compatibility
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Solution Overview
Problem
Existing memory modules have varying connection methods, requiring specific types of modules for different sockets, which can lead to compatibility issues and inefficiencies in electronic device assemblies.
Innovation Solution
A memory module design featuring a module printed circuit board with a chip region and a pad region, including first and second pads on opposite surfaces, where the first pads are positioned farther from the chip region than the second pads, and are connected via conductive lines and vias to ensure efficient signal and power transmission.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If memory modules use different connection methods for different sockets, then compatibility with various sockets is improved, but device complexity and manufacturing complexity increase
Solution Approach 1:
The memory module employs a universal connector design with contact pads arranged to accommodate multiple socket types. The connector includes first contact pads on a first surface and second contact pads on a second surface, allowing the same memory module to be compatible with different socket configurations without requiring different connection methods for different sockets.
2Productivity
If contact pads are positioned closer to the chip region, then connection efficiency is improved, but susceptibility to static electricity damage increases
Solution Approach 1:
The memory module applies different functional qualities to different contact pads based on their positions. First contact pads positioned farther from the chip region are designated as ESD protection pads, while second contact pads positioned closer to the chip region serve as signal or power pads. This local differentiation allows signal pads to be close to the chip for efficient transmission while dedicated ESD pads are positioned to provide protection against static electricity damage.
3Ease of operation
If insertion force is reduced for easier installation, then ease of operation is improved, but connection reliability may deteriorate
Solution Approach 1:
The connector incorporates a dynamic engagement mechanism where the memory module can be inserted with minimal force, and the contact pads are arranged to naturally engage with the socket contacts upon insertion. The first contact pads on the first surface and second contact pads on the second surface are positioned to provide progressive engagement, ensuring reliable electrical connection without requiring excessive insertion force.
Data Source
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AI summary
Disclosed is a memory module comprising a module printed circuit board including a chip region and a pad region and a memory chip provided on the module printed circuit board in the chip region. The module printed circuit board includes a board including a first surface and a second surface disposed opposite to each other, a first pad provided on the first surface in the pad region, and a second pad provided on the second surface in the pad region. The first pad is disposed farther from the chip region than the second pad.